# US 2021/0171802 A1 · Adhesive sheet for temporary fixation and method of manufacturing semiconductor device using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0171802 A1 - Document ID: US20210171802A1 - Status: Published application - Kind: A1 - Application number: 16/762,863 - Filed: 2019-03-28 - Published: 2021-06-10 - Earliest claimed: 2018-03-28 - Assignees: LG Chem, Ltd. - Applicants: LG Chem, Ltd. - Inventors: Sera KIM; Ji Ho HAN; Kwang Joo LEE - Web page: https://patentgrep.com/patent/US20210171802A1 ## CPC - C09J 7/22: Plastics; Metallised plastics - C08F 265/06: Polymerisation of acrylate or methacrylate esters on to polymers thereof - C09J 7/385: {Acrylic polymers} - C09J 7/40: characterised by release liners - C09J 133/08: Homopolymers or copolymers of acrylic acid esters - C09J 133/24: Homopolymers or copolymers of amides or imides - C09J 151/003: {grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds (C09J151/04, C09J151/06 take precedence)} - C09J 167/02: Polyesters derived from dicarboxylic acids and dihydroxy compounds (C09J167/06 takes precedence) - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - C08F 220/1808: {C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate} - C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors - C09J 2301/124: the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape - C09J 2301/208: the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive - C09J 2301/312: parameters being the characterizing feature - C09J 2301/416: use of irradiation - C09J 2433/00: Presence of (meth)acrylic polymer - C09J 2467/006: in the substrate - C09J 2471/006: in the substrate - C09J 2477/006: in the substrate - C09J 2481/006: in the substrate - H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer} - H10P 72/7442: {Separation by peeling} - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided. ## Claims ### Claim 1 An adhesive sheet for temporary fixation, the adhesive sheet comprising: a polymer base film having a glass transition temperature (Tg) of at least 60° C.; and at least one adhesive layer including a binder resin having a photoreactive functional group, a photoinitiator having activity at a wavelength of 300 nm or more, and a tertiary amine compound, wherein a ratio of an adhesive force (A2) to an initial adhesive force (A1) is 50% or less, where the initial adhesive force (A1) is measured after heat-treating the adhesive layer at a temperature of 150° C. to 200° C. and the adhesive force (A2) is measured after light-irradiating the heat-treated adhesive layer. ### Claim 2 (depends on 1) The adhesive sheet for temporary fixation of claim 1, wherein the ratio (R) of the adhesive force (A2) to the initial adhesive force (A1) is defined by General Formula 1: R (%)=A2′*100/A1′ [General Formula 1] wherein, in the General Formula 1, A1′ represents the adhesive force of the adhesive layer after heat treatment at 180° C. for 2 hours, and A2′ represents the adhesive force of the adhesive layer measured after light-irradiating the heat-treated adhesive layer with UV at a mixed wavelength of 200 nm to 500 nm at a light dose of 100 mJ/cm2 to 1000 mJ/cm2. ### Claim 3 (depends on 1) The adhesive sheet for temporary fixation of claim 1, wherein the polymer base film has transmittance of 50% or more at a wavelength of 300 nm or more. ### Claim 4 (depends on 1) The adhesive sheet for temporary fixation of claim 1, wherein the polymer base film includes one or more polymer compounds selected from the group consisting of polyimide, polyamideimide, polyetherether ketone, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, and polyamide. ### Claim 5 (depends on 1) The adhesive sheet for temporary fixation of claim 1, wherein the binder resin includes a first (meth)acrylate repeating unit including a benzoylphenyl group; and a second (meth)acrylate repeating unit including one or more functional groups selected from the group consisting of a hydroxyl group, a carboxyl group, and a nitrogen-containing functional group, and 20 to 95 mol % of the second (meth)acrylate repeating unit including a photopolymerizable (meth)acrylate-based side chain. ### Claim 6 (depends on 1) The adhesive sheet for temporary fixation of claim 1, wherein the photoinitiator includes one or more selected from the group consisting of thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, dodecylthioxanthone, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, 2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropan-1-one, a mixture of oxy-phenyl-acetic acid 2-[2-oxo-2-phenyl-acetoxy-ethoxy]-ethylether and oxy-phenyl-acetic acid 2-[2-hydroxy-ethoxy]-ethylester, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide. ### Claim 7 (depends on 1) The adhesive sheet for temporary fixation of claim 1, wherein the tertiary amine compound includes one or more selected from the group consisting of ethyl-p-dimethyl aminobenzoate, methyl-p-dimethyl aminobenzoate, 2-ethylhexyl-p-dimethyl aminobenzoate, octyl-p-dimethyl aminobenzoate, diethylaminoethyl methacrylate, dimethylaminoethyl methacrylate, and N,N-dihydroxyethyl-p-toluidine. ### Claim 8 (depends on 1) The adhesive sheet for temporary fixation of claim 1, wherein a weight ratio of the photoinitiator and the tertiary amine compound is 1:1 to 20. ### Claim 9 (depends on 1) The adhesive sheet for temporary fixation of claim 1, wherein the adhesive sheet provides a function of a protective film or a carrier film of a semiconductor process. ### Claim 10 (depends on 1) The adhesive sheet for temporary fixation of claim 1, further comprising a release film on the adhesive layer. ### Claim 11 (canceled) ### Claim 12 (depends on 10) The adhesive sheet for temporary fixation of claim 10, wherein the adhesive layer is composed of two layers, and the base film is positioned between the two layers and the release film is on each of the two layers opposite side to the base film. ### Claim 13 (depends on 1) A method of manufacturing a semiconductor device, the method comprising the steps of: attaching the adhesive layer of the adhesive sheet for temporary fixation of claim 1 onto a predetermined portion of the semiconductor device; performing a predetermined process of the semiconductor device on which the adhesive sheet is attached; irradiating UV rays onto the base film of the adhesive sheet for temporary fixation after performing the predetermined process; and detaching the adhesive sheet for temporary fixation from the semiconductor device. ### Claim 14 (depends on 13) The method of claim 13, wherein the predetermined process of the semiconductor device is performed at a temperature of 60° C. to 300° C.