# US 2021/0082991 A1 · Mechanically stacked multicolor focal plane arrays and detection devices

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- Number: US 2021/0082991 A1
- Document ID: US20210082991A1
- Status: Published application
- Kind: A1
- Application number: 17/018,906
- Filed: 2020-09-11
- Published: 2021-03-18
- Earliest claimed: 2019-09-12
- Assignees: L3 Cincinnati Electronics Corporation
- Applicants: L3 Cincinnati Electronics Corporation
- Inventors: Daniel Chmielewski; Yajun Wei; Nansheng Tang; Darrel Endres; Michael Garter; Mark Greiner
- Web page: https://patentgrep.com/patent/US20210082991A1

## CPC

- H10F 39/1847: {Multispectral infrared image sensors having a stacked structure, e.g. NPN, NPNPN or multiple quantum well [MQW] structures}
- H10F 39/026: {Wafer-level processing}
- H10F 39/1843: {of the hybrid type}
- H10F 39/805: {Coatings}
- H10F 39/811: {Interconnections}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

Multicolor, stacked detector devices, focal plane arrays including multicolor, stacked detector devices, and methods of fabricating the same are disclosed. In one embodiment, a stacked multicolor detector device includes a first detector and a second detector. The first detector includes a first detector structure and a first ground plane adjacent the first detector structure. The second detector includes a second detector structure and a second ground plane adjacent the second detector structure. At least one of the first ground plane and the second ground plane is transmissive to radiation in a predetermined spectral band. The first detector and the second detector are in a stacked relationship.

## Claims

### Claim 1

A stacked multicolor detector device comprising:
a first detector comprising:
a first detector structure; and
a first ground plane adjacent the first detector structure; and
a second detector comprising:
a second detector structure; and
a second ground plane adjacent the second detector structure;
wherein:
at least one of the first ground plane and the second ground plane is transmissive to radiation in a predetermined spectral band; and
the first detector and the second detector are in a stacked relationship.

### Claim 2 (depends on 1)

The stacked multicolor detector device of claim 1, further comprising one or more additional detectors comprising:
an additional detector structure; and
an additional ground plane adjacent the additional detector structure, wherein the additional ground plane is transmissive to radiation in the predetermined spectral band and the one or more additional detectors are in the stacked relationship with the first detector structure and the second detector structure.

### Claim 3 (depends on 1)

The stacked multicolor detector device of claim 1, wherein the first detector and the second detector are individually reticulated such that reticulations pass through an individual one of the first detector and the second detector.

### Claim 4 (depends on 1)

The stacked multicolor detector device of claim 1, wherein the first detector and the second detector are reticulated together such that reticulations pass through at least part of the first detector and at least part of the second detector.

### Claim 5 (depends on 1)

The stacked multicolor detector device of claim 1, wherein:
the first detector further comprises a first dielectric structure coupled to the first detector structure; and
the second detector further comprises a second dielectric structure coupled to the second detector structure;
one or more of the first dielectric structure and the second dielectric structure comprises one or more of a filter, a distributed Bragg reflector, and an anti-reflection coating.

### Claim 6 (depends on 1)

The stacked multicolor detector device of claim 1, further comprising a read-out integrated circuit, wherein:
one of the first detector and the second detector is coupled to the read-out integrated circuit;
the stacked multicolor detector device further comprises:
a first insulated conductive signal path electrically coupling the first detector structure to a first signal electrical contact of the read-out integrated circuit; and
a second insulated conductive signal path electrically coupling the second detector structure to a second signal electrical contact of the read-out integrated circuit.

### Claim 7 (depends on 1)

The stacked multicolor detector device of claim 1, wherein one or more of the first detector structure and the second detector structure is bias-selectable to select one of at least two colors.

### Claim 8

A multicolor focal plane array comprising a plurality of active pixels, each active pixel comprising a stacked multicolor detector device further comprising:
a first detector comprising:
a first detector structure; and
a first ground plane adjacent the first detector structure; and
a second detector comprising:
a second detector structure; and
a second ground plane adjacent the second detector structure;
wherein:
at least one of the first ground plane and the second ground plane is transmissive to radiation in a predetermined spectral band; and
the first detector and the second detector are in a stacked relationship.

### Claim 9 (depends on 8)

The multicolor focal plane array of claim 8, further comprising one or more additional detectors comprising:
an additional detector structure; and
an additional ground plane adjacent the additional detector structure, wherein the additional ground plane is transmissive to radiation in the predetermined spectral band and the one or more additional detectors are in the stacked relationship with the first detector structure and the second detector structure.

### Claim 10 (depends on 8)

The multicolor focal plane array of claim 8, wherein the first detector and the second detector are individually reticulated.

### Claim 11 (depends on 8)

The multicolor focal plane array of claim 8, wherein the first detector and the second detector are reticulated together.

### Claim 12 (depends on 8)

The multicolor focal plane array of claim 8, wherein:
the first detector further comprises a first dielectric structure coupled to the first detector structure;
the second detector further comprises a second dielectric structure coupled to the second detector structure; and
one or more of the first dielectric structure and the second dielectric structure comprises one or more of a filter, a distributed Bragg reflector, and an anti-reflection coating.

### Claim 13 (depends on 8)

The multicolor focal plane array of claim 8, further comprising a read-out integrated circuit, wherein:
one of the first detector and the second detector is coupled to the read-out integrated circuit; and
the stacked multicolor detector device further comprises:
a first insulated conductive signal path electrically coupling the first detector structure to a first signal electrical contact of the read-out integrated circuit; and
a second insulated conductive signal path electrically coupling the second detector structure to a second signal electrical contact of the read-out integrated circuit.

### Claim 14 (depends on 8)

The multicolor focal plane array of claim 8, further comprising at least one ground pixel comprising:
a first detector if the at least one ground pixel; and
a second detector of the at least one ground pixel, wherein the first detector of the at least one ground pixel and the second detector of the at least one ground pixel are in the stacked relationship.

### Claim 15 (depends on 14)

The multicolor focal plane array of claim 14, wherein one or more of the first detector of the at least one ground pixel and the second detector of the at least one ground pixel comprises one or more conductive layers.

### Claim 16 (depends on 14)

The multicolor focal plane array of claim 14, further comprising a read-out integrated circuit, wherein the first detector of the at least one ground pixel and the second detector of the at least one ground pixel are electrically coupled together and electrically coupled to one or more ground electrical contacts of the read-out integrated circuit.

### Claim 17 (depends on 16)

The multicolor focal plane array of claim 16, wherein the first detector of the at least one ground pixel and the second detector of the at least one ground pixel are electrically coupled together and also electrically coupled to the one or more ground electrical contacts by one or more non-insulated conductive paths through the first detector of the at least one ground pixel and the second detector of the at least one ground pixel.

### Claim 18 (depends on 14)

The multicolor focal plane array of claim 14, further comprising a read-out integrated circuit, wherein the first detector and the second detector of the at least one ground pixel are electrically isolated from one another such that:
the first detector of the at least one ground pixel is electrically coupled to one or more first ground electrical contacts of the read-out integrated circuit; and
the second detector of the at least one ground pixel is electrically coupled to one or more second ground electrical contacts of the read-out integrated circuit.

### Claim 19 (depends on 18)

The multicolor focal plane array of claim 18, wherein:
the first detector of the at least one ground pixel is electrically coupled to the one or more first ground electrical contacts of the read-out integrated circuit by one or more first conductive paths that are not insulated in the first detector and are insulated in the second detector; and
the second detector of the at least one ground pixel is electrically coupled to the one or more second ground electrical contacts of the read-out integrated circuit by one or more second conductive paths through the second detector.

### Claim 20 (depends on 8)

The multicolor focal plane array of claim 8, wherein one or more of the first detector structure and the second detector structure is bias-selectable to select one of at least two colors.