Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorSumi TANAKA
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus for processing a substrate is provided. In the substrate processing apparatus, a substrate support has an upper surface on which a substrate is placed and serves to heat the substrate placed thereon. At least one substrate support pin is configured to protrude from and retract below the upper surface of the substrate support and to support the substrate. Further, a light irradiation mechanism is configured to irradiate light to a specific portion of the substrate placed on the upper surface of the substrate support, corresponding to a position where the at least one substrate support pin protrudes and retracts, to heat the specific portion.
Claims12
A substrate processing apparatus for processing a substrate, comprising:
- a substrate support having an upper surface on which a substrate is placed and serving to heat the substrate placed thereon;
- at least one substrate support pin configured to protrude from and retract below the upper surface of the substrate support and to support the substrate;
- and
- a light irradiation mechanism configured to irradiate light to a specific portion of the substrate placed on the upper surface of the substrate support, corresponding to a position where said at least one substrate support pin protrudes and retracts, to heat the specific portion.
A substrate processing method for processing a substrate, comprising:
- relatively moving a substrate support and at least one substrate support pin that protrudes from and retracts below an upper surface of the substrate support and placing the substrate on the upper surface of the substrate support;
- and
- performing predetermined processing on the substrate placed on a heated upper surface of the substrate support,
- wherein said performing the predetermined processing includes heating a specific portion of the substrate placed on the upper surface of the substrate support, corresponding to a position where said at least one substrate support pin protrudes and retracts by irradiating light from a light irradiation mechanism to the specific portion.
Dependencies are inferred from the claim text.