Substrate processing apparatus
AssigneeKokusai Electric Corporation
InventorsHidehiro YANAI, Tadashi TAKASAKI
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AssigneeKokusai Electric Corporation
InventorsHidehiro YANAI, Tadashi TAKASAKI
Estimating the term…
Described herein is a technique capable of enhancing uniformity of a film formed by a rotary type apparatus. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process vessel provided with process regions where the substrate is processed; a rotary table provided in the process vessel to be rotatable about a point outside the substrate to enable the substrate on the rotary table to sequentially pass through the process regions; and a gas supply nozzle including: a forward path portion provided in at least one of the process regions and extending from a wall of the process vessel toward a center portion of the rotary table; and a return path portion connected with the forward path portion via a bent portion and extending from the center portion of the rotary table toward the wall of the process vessel.
A substrate processing apparatus configured to process a substrate by supplying a process gas, the substrate processing apparatus comprising:
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The substrate processing apparatus of claim 20, wherein the front end of the return path portion comprises an opening.
Dependencies are inferred from the claim text.