Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate
AssigneeFujimi Incorporated
InventorsTsutomu YOSHINO, Shogo ONISHI, Yasuto ISHIDA
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Abstract
To provide a means capable of sufficiently removing organic residues present on the surface of a polishing object after polishing containing silicon oxide or polysilicon. A surface treatment composition contains a polymer having a constituent unit represented by Formula (1) below and water and is used for treating the surface of a polishing object after polishing, in which, in Formula (1) above, R1 is a hydrocarbon group having 1 to 5 carbon atoms and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.
Claims20
A surface treatment composition comprising:
- a polymer having a constituent unit represented by Formula (1) below;
- and
- water,
- the surface treatment composition being used for treating a surface of a polishing object after polishing,
- wherein, in Formula (1) above, R1 is a hydrocarbon group having 1 to 5 carbon atoms and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.
A method for producing a surface treatment composition comprising:
- mixing a polymer having a constituent unit represented by Formula (1) below and water,
- wherein, in Formula (1) above, R1 is a hydrocarbon group having 1 to 5 carbon atoms and R2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.
Dependencies are inferred from the claim text.