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US 2021/0071035 A1Published application
Carbon abrasive and polishing slurry and method of manufacturing semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsKenji TAKAI, Do Yoon KIM
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Abstract
A carbon abrasive including a carbon nanoparticle and a positively charged polymer, a positively charged oligomer, of a combination thereof, on a surface of the carbon nanoparticle. A polishing slurry including the carbon abrasive, and a method of manufacturing a semiconductor device using the polishing slurry.
Claims21
A carbon abrasive comprising
- a carbon nanoparticle, and
- a positively charged polymer, a positively charged oligomer, or a combination thereof, disposed on a surface of the carbon nanoparticle.
Dependencies are inferred from the claim text.