Additive manufacturing employing solvent-free polyimide-containing formulations
AssigneeStratasys, Inc.
InventorsLev KUNO, Mariana POKRASS, Elena SHPAYZER
Life of this patent
Estimating the term…
Abstract
Formulations usable in additive manufacturing, 3D inkjet printing in particular, of a three-dimensional object that contains a polyimide material, and additive manufacturing utilizing same are provided. The formulations contain a polyimide precursor (e.g., a bismaleimide) and an additional curable material, which is a multifunctional curable material, and are devoid of an organic solvent.
Claims22
1-50. (canceled)
A formulation comprising a polyimide precursor and a multifunctional curable material, the formulation being devoid of an organic solvent.
A method of additive manufacturing of a three-dimensional object which comprises, in at least a portion thereof, a polyimide-containing material, the method comprising sequentially forming a plurality of layers in a configured pattern corresponding to the shape of the object, thereby forming the object,
- wherein said formation of each of at least a few of said layers comprises dispensing a modeling material formulation which comprises a polyimide precursor and a multifunctional curable material;
- and exposing each of the dispensed layers to a curing condition to thereby form a cured modeling material comprising said polyimide-containing material,
- and wherein:
- said modeling material formulation which comprises said polyimide precursor is devoid of an organic solvent.
Dependencies are inferred from the claim text.