Electronic device comprising optical electronic components and fabricating process

An electronic assembly, comprising:

• a receiving substrate includes a network of electrical connections;
• and
• an electronic device, comprising:
• a first electronic component comprising a first opaque carrier substrate having a first back side and a first front side, a first electronic chip having a back side mounted to the first front side of the first opaque carrier substrate, said first electronic chip including a first integrated optical element at a front side of the first electronic chip, a first overmolded transparent block encapsulating the first electronic chip above the first front side of the first opaque carrier substrate, and first electrical connections between the first electronic chip and first back electrical contacts at the first back side of the first opaque carrier substrate;
• a second electronic component comprising a second opaque carrier substrate having a second back side and a second front side, a second electronic chip having a back side mounted to the second front side of the second opaque carrier substrate, said second electronic chip including a second integrated optical element at a front side of the second electronic chip, a second overmolded transparent block encapsulating the second electronic chip above the second front side of the second opaque carrier substrate, and second electrical connections between the second electronic chip and second back electrical contacts at the second back side of the second opaque carrier substrate;
• and
• an opaque overmolded grid for encapsulating and holding both the first and second electronic components, wherein the opaque overmolded grid is configured so that respective back sides of the first and second electronic components are exposed and so that at least zones of front sides of the first and second electronic components located in front of the first and second integrated optical elements are exposed;
• wherein said electronic device is mounted to the receiving substrate in a position such that back sides of the first and second electronic components are adjacent to the receiving substrate;
• and
• wherein the first and second back electrical contacts are connected to the electrical contacts of the network of electrical connections of the receiving substrate.

A process for fabricating an electronic device, comprising the following steps:

• providing a first electronic component and a second electronic component, wherein each electronic component comprises a carrier substrate having a back side and a front side, an electronic chip having a back side mounted on the front side of the carrier substrate, an integrated optical element at a front side of the electronic chip, an overmolded transparent block encapsulating the electronic chip above the front side of the carrier substrate, and electrical connections between the electronic chip and back electrical contacts at the back side of the carrier substrate;
• mounting, at distance from each other, the first and second electronic components above a side of a provisional carrier substrate, in positions such that the back sides, or conversely the front sides, of the first and second electronic components are adjacent to the said side of the provisional carrier substrate;
• placing the provisional carrier substrate with the first and second electronic components in a cavity of a mold, in positions such that the provisional carrier substrate is adjacent to one face of the mold and such that the front sides of the electronic components are at least partially adjacent to another face of the mold, at least in the zones of the optical elements, or conversely such that the back sides of the electronic components are adjacent to another face of the mold;
• injecting an opaque encapsulating material into the cavity so as to obtain an encapsulating and holding grid containing spaces in which the first and second electronic components are located;
• and
• demolding an electronic device from the mold.