Package structure and method of fabricating the same

A package structure, comprising:

• a circuit substrate;
• an interposer structure disposed on the circuit substrate, wherein the interposer structure comprises:
• a core portion;
• a plurality of through vias formed in the core portion;
• and
• a redistribution structure located on the core portion and electrically connected to the plurality of through vias and the circuit substrate;
• a plurality of semiconductor dies disposed on the interposer structure and electrically connected to the plurality of through vias and the redistribution structure;
• and
• an insulating encapsulant disposed on the interposer structure and encapsulating the plurality of semiconductor dies, wherein the insulating encapsulant comprises a first portion and a second portion surrounding the first portion, the first portion is encapsulating the plurality of semiconductor dies and overlapped with the interposer structure, the second portion is non-overlapped with the interposer structure, and a height of the first portion is different than a height of the second portion.

A method of fabricating a package structure, comprising:

• forming a semiconductor package, which comprises:
• providing a core portion having a plurality of package regions and a sub region separating each of the plurality of package regions, wherein a plurality of through vias is formed in the core portion in the plurality of package regions;
• attaching a plurality of semiconductor dies on a first surface of the core portion in each of the plurality of package regions, wherein the plurality of semiconductor dies is electrically connected to the plurality of though vias;
• forming an insulating encapsulant on the first surface of the core portion in the plurality of package regions and the sub region, and to encapsulate the plurality of semiconductor dies;
• forming a redistribution structure located on a second surface of the core portion opposite to the first surface, and in the plurality of package regions and the sub region, the redistribution structure electrically connected to the plurality of through vias, wherein the core portion, the plurality of through vias, and the redistribution structure constitute an interposer structure;
• performing a sawing process to remove portions of the interposer structure and portions of the insulating encapsulant in the sub region, so that the insulating encapsulant is formed with a first portion and a second portion protruding from the first portion, the first portion is encapsulating the plurality of semiconductor dies and has a planar first surface, and the second portion has a planar second surface located at a different level than the planar first surface;
• separating the plurality of package regions from one another after the sawing process to form the semiconductor package;
• and
• attaching the semiconductor package onto a circuit substrate through a plurality of conductive terminals.