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US 2021/0066162 A1Published application
Semiconductor package with attachment and/or stop structures
AssigneeIntel Corporation
InventorsSergio A. CHAN ARGUEDAS, Nicholas S. HAEHN, Edvin CETEGEN, Nicholas NEAL, Jacob VEHONSKY, Steve S. CHO, Rahul JAIN, Antariksh Rao Pratap SINGH, Tarek A. IBRAHIM, Thomas HEATON, Vipul MEHTA
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Abstract
A device is disclosed. The device includes a substrate, a die on the substrate, a thermal interface material (TIM) on the die, and solder bumps on a periphery of a top surface of the substrate. An integrated heat spreader (IHS) is formed on the solder bumps. The IHS covers the TIM.
Claims24
A device, comprising:
- a substrate;
- a die on the substrate;
- a thermal interface material (TIM) on the die;
- solder bumps on a periphery of a top surface of the substrate, the solder bumps extending upward from the substrate;
- and
- an integrated heat spreader (IHS) on the solder bumps, the IHS covering the TIM.
3 more elements
A device, comprising:
- a substrate;
- solder bumps on a periphery of a top surface of the substrate, the solder bumps extending upward from the substrate and defining a space;
- a sealant on the top surface of the substrate, the sealant in the space defined by the solder bumps;
- and
- an integrated heat spreader (IHS) on the solder bumps and the sealant.
2 more elements
A system, comprising:
- one or more processing components;
- and
- one or more storage components, at least one of the one or more processing components and the one or more storage components including a device comprising:
- a substrate;
- a die on the substrate;
- a thermal interface material (TIM) on the die;
- solder bumps on a periphery of a top surface of the substrate, the solder bumps extending upward from the substrate;
- and
- an integrated heat spreader (IHS) on the solder bumps, the IHS covering the TIM.
6 more elements
A method, comprising:
- providing a substrate;
- placing a die on the substrate;
- forming a TIM on the die;
- forming solder bumps on a periphery of a top surface of the substrate, the solder bumps extending upward from the substrate;
- and
- placing an integrated heat spreader (IHS) on the solder bumps, the IHS covering the TIM.
3 more elements
Dependencies are inferred from the claim text.