Semiconductor fabrication system and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Sheng KUO, Chih-Hung HUANG, Guan-Wei HUANG, Ping-Yung YEN, Hsuan LEE, Jiun-Rong PAI
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Sheng KUO, Chih-Hung HUANG, Guan-Wei HUANG, Ping-Yung YEN, Hsuan LEE, Jiun-Rong PAI
Estimating the term…
A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.
A system for manufacturing a semiconductor electronic device, comprising:
A method of manufacturing a semiconductor electronic device, comprising:
A non-transitory computer-readable medium storing instructions that, when executed by a processor of a computer-implemented control system, cause the computer-implemented control system to:
Dependencies are inferred from the claim text.