Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
AssigneeKioxia Corporation
InventorHiroyasu IIMORI
Life of this patent
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Abstract
A semiconductor manufacturing apparatus according to an embodiment includes: a stage to have a plurality of pins to hold a semiconductor substrate having a first surface on which a film to be etched is formed and a second surface positioned on an opposite side to the first surface; a nozzle to eject a liquid chemical toward the first surface of the semiconductor substrate from above the stage; and an optical measurer to radiate light toward the second surface of the semiconductor substrate from a side of the stage during ejection of the liquid chemical, and to measure a displacement amount of the semiconductor substrate based on a state of reception of light reflected on the second surface.
Claims10
A semiconductor manufacturing apparatus comprising:
- a stage to have a plurality of pins to hold a semiconductor substrate having a first surface on which a film to be etched is formed and a second surface positioned on an opposite side to the first surface;
- a nozzle to eject a liquid chemical toward the first surface of the semiconductor substrate from above the stage;
- and
- an optical measurer to radiate light toward the second surface of the semiconductor substrate from a side of the stage during ejection of the liquid chemical, and to measure a displacement amount of the semiconductor substrate based on a state of reception of light reflected on the second surface.
A manufacturing method of a semiconductor device, comprising:
- holding, with a plurality of pins provided on a stage, a semiconductor substrate having a first surface on which a film to be etched is formed and a second surface positioned on an opposite side to the first surface;
- ejecting a liquid chemical toward the first surface of the semiconductor substrate from above the stage;
- and
- radiating light toward the second surface of the semiconductor substrate from a side of the stage during ejection of the liquid chemical, and measuring a displacement amount of the semiconductor substrate based on a state of reception of light reflected on the second surface.
Dependencies are inferred from the claim text.