Wiring structure, preparation method thereof, and display device
AssigneeBoe Technology Group Co., Ltd.
InventorsHaixu Li, Zhanfeng Cao, Ke Wang, Jianguo Wang
Life of this patent
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Abstract
The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.
Claims21
A wiring structure, comprising,
- a substrate;
- a pre-arranged layer located on the substrate;
- and
- an electrode wiring covering the pre-arranged layer;
- wherein
- in a direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.
(canceled)
The wiring structure according to claim 18, wherein a material of the seed layer comprises one of copper and molybdenum.
A display device, comprising a wiring structure, wherein the wiring structure comprises:
- a substrate;
- a pre-arranged layer located on the substrate;
- and
- an electrode wiring covering the pre-arranged layer;
- wherein in a direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.
A preparation method of a wiring structure, comprising:
- providing a substrate;
- forming a pre-arranged layer on the substrate;
- forming retaining wall structures on both sides of the pre-arranged layer, wherein the retaining wall structures define a wiring position;
- forming an electrode wiring at the wiring position;
- and
- removing the retaining wall structures;
- wherein in a direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.
Dependencies are inferred from the claim text.