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US 2021/0063802 A1Published application
Electronic device and method for manufacturing the same
AssigneeInnolux Corporation
InventorsHsin-Hao Huang, Yu-Chih Tseng, Chu-Hong Lai
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Abstract
An electronic device includes a first flexible substrate, a bonding pad and a first supporting film. The bonding pad is disposed on the first flexible substrate, and a first supporting film is attached to the first flexible substrate. The first supporting film has a first opening corresponding to the bonding pad.
Claims20
An electronic device, comprising:
- a first flexible substrate;
- a bonding pad disposed on the first flexible substrate;
- and
- a first supporting film attached to the first flexible substrate, wherein the first supporting film has a first opening corresponding to the bonding pad.
1 more element
A method of manufacturing an electronic device, comprising:
- providing a panel, the panel comprising:
- a first flexible substrate;
- a bonding pad disposed on the first flexible substrate;
- and
- a first supporting film attached to the first flexible substrate and having a first opening corresponding to the bonding pad of the first flexible substrate;
- and
- bonding an integrated circuit or a circuit board onto the bonding pad.
4 more elements
Dependencies are inferred from the claim text.