Test module, test handler, and method of testing semiconductor device by using the test handler

A test handler, comprising:

• a tray on which a semiconductor device is mounted;
• and
• a test apparatus adjacent to the tray, the test apparatus including a test module electrically connected to the semiconductor device,
• wherein the test module includes:
• a tester that electrically tests the semiconductor device;
• a device under test (DUT) board connected to the semiconductor device;
• and
• a base board connected to the DUT board and the tester,
• wherein the base board includes:
• a lower plate;
• a plurality of connection lines that penetrate the lower plate;
• an upper plate disposed on the lower plate;
• a docking connector that penetrates the upper plate and connects the plurality of connection lines to the DUT board;
• a first temperature controller disposed between the lower plate and the docking connector, the first temperature controller maintaining the connection lines at a first temperature;
• and
• a second temperature controller, the second temperature controller maintaining the docking connector at a second temperature different from the first temperature.

A method of testing a semiconductor device, the method comprising:

• providing a test chamber with a test tray on which the semiconductor deice is mounted;
• providing the test chamber with a first hot air or a first cool air to heat or cool the semiconductor device to a first temperature, wherein the first hot air and the first cool air are different from room temperature air;
• providing a first temperature controller with the room temperature air to maintain a plurality of connection lines at a second temperature different from the first temperature, wherein the first temperature controller is disposed below a device under test (DUT) board, and wherein the connection lines are connected to the DUT board;
• providing a second temperature controller disposed between the DUT board and the first temperature controller with a second hot air or a second cool air to heat or cool a docking connector to the first temperature, wherein the second hot air and the second cool air are different from room temperature air, and wherein the docking connector connects the connection lines to the DUT board;
• and
• testing the semiconductor device by using a tester connected to the connection lines.