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US 2021/0063445 A1Published application
Sensor devices with sensor chip and busbar
AssigneeInfineon Technologies AG
InventorsRainer Markus SCHALLER, Juergen HOEGERL, Volker STRUTZ
Life of this patent
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Abstract
A sensor device comprises a dielectric substrate, a busbar mechanically connected to the dielectric substrate, a cavity formed in the dielectric substrate, and a sensor chip arranged in the cavity, wherein the sensor chip is designed to detect a magnetic field induced by an electric current flowing through the busbar, wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar.
Claims20
A sensor device, comprising:
- a dielectric substrate;
- a busbar mechanically connected to the dielectric substrate;
- a cavity formed in the dielectric substrate;
- and
- a sensor chip arranged in the cavity, wherein the sensor chip is configured to detect a magnetic field induced by an electric current flowing through the busbar, and
- wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar.
3 more elements
A sensor device, comprising:
- a shell;
- a busbar arranged in the shell;
- and
- a sensor package arranged in the shell, comprising a sensor chip encapsulated in the sensor package, wherein the sensor chip is configured to detect a magnetic field induced by an electric current flowing through the busbar, and
- wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar.
2 more elements
A sensor device, comprising:
- a busbar having an opening;
- and
- a sensor package, comprising an encapsulation material and a sensor chip encapsulated by the encapsulation material,
- wherein the sensor chip is configured to detect a magnetic field induced by an electric current flowing through the busbar, and
- wherein the sensor package is arranged within the opening of the busbar.
2 more elements
A sensor device, comprising:
- a pre-encapsulated leadframe, comprising a leadframe and an encapsulation material, wherein the leadframe is encapsulated by the encapsulation material, and wherein a part of the leadframe forms a busbar;
- and
- a sensor chip arranged above the busbar, wherein the sensor chip is arranged outside the encapsulation material and wherein the sensor chip is configured to detect a magnetic field induced by an electric current flowing through the busbar,
- wherein in an orthogonal projection of the sensor chip onto the busbar, the sensor chip at least partly overlaps the busbar, and
- wherein the encapsulation material of the pre-encapsulated leadframe is arranged between the busbar and the sensor chip.
2 more elements
Dependencies are inferred from the claim text.