Inertial sensor, electronic apparatus, and vehicle

An inertial sensor comprising:

• a sensor unit;
• a base substrate having the sensor unit arranged at a first surface thereof, the base substrate having a first lateral surface intersecting the one surface, a second lateral surface opposite to the first lateral surface, a third lateral surface intersecting the one surface and adjacent to the first lateral surface and the second lateral surface, a fourth lateral surface intersecting the one surface and adjacent to the first lateral surface and the second lateral surface and opposite to the third lateral surface, and a second surface opposite to the first surface;
• a package accommodating the sensor unit and the base substrate, the package having an inner bottom surface, a first inner wall surface intersecting the inner bottom surface and opposite the first lateral surface, a second inner wall surface intersecting the inner bottom surface and opposite the second lateral surface, a third inner wall surface intersecting the inner bottom surface and opposite the third lateral surface, and a fourth inner wall surface intersecting the inner bottom surface and opposite the fourth lateral surface;
• a first adhesive bonding together the second surface of the base substrate and the inner bottom surface of the package;
• and
• a second adhesive bonding together the first inner wall surface of the package and the first lateral surface, bonding together the second inner wall surface of the package and the second lateral surface, bonding together the third inner wall surface of the package and the third lateral surface, and bonding together the fourth inner wall surface of the package and the fourth lateral surface, the second adhesive being different from the first adhesive.

An inertial sensor comprising:

• a structure having a sensor element and an integrated circuit;
• and
• a package accommodating the structure,
• the integrated circuit having a drive circuit which drives the sensor element and a processing unit which processes a signal from the sensor element,
• the sensor element having a base substrate and a sensor unit,
• the base substrate having a first surface at where the sensor unit arranged, a first lateral surface intersecting the first surface, a second lateral surface opposite to the first lateral surface, and a second surface opposite to the first surface,
• the second surface being bonded to the integrated circuit with a first adhesive,
• the package having an inner bottom surface, a first inner wall surface intersecting the inner bottom surface and opposite the first lateral surface, and a second inner wall surface intersecting the inner bottom surface and opposite the second lateral surface,
• the first inner wall surface of the package being bonded to the first lateral surface with a second adhesive that is different from the first adhesive,
• the second inner wall surface of the package being bonded to the second lateral surface with a third adhesive that is different from the first adhesive.