Apparatus and method for checking at least one solder joint between a printed circuit board and a current sensor
AssigneeInfineon Technologies AG
InventorTheodor KRANZ
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a concept for checking at least one solder joint between a printed circuit board and a current sensor, including: measuring, by means of the current sensor, an electric current through the solder joint; measuring at least one temperature of the current sensor as a function of the electric current; and ascertaining a quality of the solder joint based on the temperature and the electric current.
Claims12
A method for checking a solder joint between a printed circuit board and a current sensor, comprising:
- measuring, by means of the current sensor, an electric current through the solder joint;
- measuring a temperature of the current sensor as a function of the electric current;
- and
- ascertaining a quality of the solder joint based on the temperature and the electric current.
An apparatus for checking a solder joint between a printed circuit board and a current sensor, wherein the current sensor is configured to measure an electric current through the solder joint and measure a temperature of the current sensor as a function of the electric current, wherein the apparatus comprises:
- a processor coupled to the current sensor, the processor configured to receive the measured electric current and the measured temperature from the current sensor, and ascertain a quality of the solder joint based on the measured temperature and the measured electric current.
Dependencies are inferred from the claim text.