Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board

A polyphenylene ether resin composition comprising:

• a modified polyphenylene ether compound (A) that is terminally modified with a substituent having a carbon-carbon unsaturated double bond, and
• a crosslinking-type curing agent (B) having two or more carbon-carbon unsaturated double bonds in each molecule,
• the modified polyphenylene ether compound (A) including a modified polyphenylene ether compound (A-1) represented by formula (1), and a modified polyphenylene ether compound (A-2) represented by formula (2):
• (In formulas (1) and (2), R1 to R8 and R9 to R16 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, a formyl group, an alkylcarbonyl group, an alkenylcarbonyl group, or an alkynylcarbonyl group. Y represents a linear, branched or cyclic hydrocarbon having 20 or less carbon atoms. X1 and X2, which may be the same or different from each other, represent a substituent having a carbon-carbon unsaturated double bond. A and B respectively represent structures shown by formulas (3) and (4):
• In formulas (3) and (4), m and n each represent an integer of 0 to 20. R17 to R20 and R21 to R24 each independently represent a hydrogen atom or an alkyl group.)