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US 2021/0061986 A1Published application
Epoxy resin composition and electronic component device
AssigneeHitachi Chemical Company, Ltd.
InventorsDongchul KANG, Masashi YAMAURA, Kenta ISHIBASHI, Takuya KODAMA, Keichi HORI, Mika TANAKA
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Abstract
An epoxy resin composition includes an epoxy resin; a curing agent; alumina particles; and a silane compound which does not have a functional group that is reactive with an epoxy group and which has a functional group that is unreactive with an epoxy group, wherein the silane compound has a structure in which the functional group that is unreactive with an epoxy resin is bound to a silicon atom, or is bound to a silicon atom via a chain hydrocarbon group having 1 to 5 carbon atoms.
Claims7
An epoxy resin composition, comprising:
- an epoxy resin;
- a curing agent;
- alumina particles;
- and
- a silane compound which does not have a functional group that is reactive with an epoxy group and which has a functional group that is unreactive with an epoxy group, wherein the silane compound has a structure in which the functional group that is unreactive with an epoxy resin is bound to a silicon atom, or is bound to a silicon atom via a chain hydrocarbon group having 1 to 5 carbon atoms.
2 more elements
Dependencies are inferred from the claim text.