Enclosed cavity structures
AssigneeX-Celeprint Limited
InventorsRonald S. Cok, Raja Fazan Gul, António José Marques Trindade
Life of this patent
Estimating the term…
Abstract
An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.
Claims21
1-70. (canceled)
A cavity structure, comprising:
- a component support forming walls defining sides of a volume;
- a component disposed in or over the volume and physically connected to the component support;
- and
- at least a portion of a structure tether physically connected to the component support exterior to the volume.
A cavity structure wafer, comprising:
- a wafer having a sacrificial layer comprising a sacrificial portion;
- a component support forming walls defining sides of a volume disposed entirely over the sacrificial portion;
- a component disposed in or over the volume and physically connected to the component support;
- and
- at least a portion of a structure tether physically connecting the component support to the component source wafer exterior to the volume.
A cavity structure wafer, comprising:
- a wafer;
- a component support forming walls defining sides of a volume;
- a component disposed in or over the volume and physically connected to the component support;
- and
- at least a portion of a structure tether physically connecting the component support to the wafer exterior to the volume such that the component support and the component are suspended over the component source wafer defining a gap therebetween.
A method of making a cavity structure, comprising:
- providing a cavity structure source wafer, a protection layer disposed on the cavity structure source wafer, and a component support disposed on the protection layer;
- disposing a component on or over the component support;
- disposing a mask over the component and over a portion of the component support, the portion of the component support defining walls;
- etching the component support to form the walls and etching the protection layer to expose at least a portion of the cavity structure source wafer;
- and
- encapsulating the component and the walls with a patterned encapsulation layer physically connecting the component to the walls, defining a structure tether, and exposing a portion of the cavity structure source wafer.
Dependencies are inferred from the claim text.