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US 2021/0060902 A1Published application
Circuit board and method for manufacturing the same
AssigneeNippon Pillar Packing Co., Ltd.
InventorsTakeshi OKUNAGA, Miyuki KOBAYASHI, Tatsuya TAMAKI, Kenpei YAMASAKI, Tomoki HAYASHI
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Abstract
A circuit board according to the present invention includes: a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and second layers containing non-fusible fluororesin that are arranged on the two surfaces of the first layer.
Claims10
A circuit board comprising:
- a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated;
- and
- second layers containing non-fusible fluororesin that are arranged on two surfaces of the first layer.
A method for manufacturing a circuit board, comprising:
- forming a first layer by impregnating a fiber base material with a dispersion liquid of fusible fluororesin and heating the fiber base material at a temperature lower than the melting point of the fusible fluororesin;
- and
- forming second layers containing non-fusible fluororesin on two surfaces of the first layer.
Dependencies are inferred from the claim text.