Low density microspheres
AssigneeTechnion Research & Development Foundation Limited
InventorsLev VAIKHANSKI, Yachin COHEN
Life of this patent
Estimating the term…
Abstract
Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.
Claims9
A honeycomb comprising foam, said foam comprises expanded polymeric microspheres coated with a conductive additive, said polymeric microspheres being fused to each other in at least one portion thereof, said microspheres are limited to size variation of less than 15%, wherein said foam is characterized by a density below 15 kg/m3, wherein said density is characterized as being a uniform density, said uniform density being characterized as having at least 90% of said foam with densities that vary within a range of less than 15%, wherein said polymeric microspheres at least partially fill either one or both sides, and part, or all cells of said honeycomb.
Dependencies are inferred from the claim text.