In-ear headphone
AssigneeMerry Electronics(Shenzhen) Co., Ltd.
InventorsHung-Uei Jou, Chung-Yi Huang
Life of this patent
Estimating the term…
Abstract
An in-ear headphone includes a shell, a speaker, a circuit board, and a sensing structure. The shell has an accommodating space. The speaker is disposed in the accommodating space. The circuit board is disposed in the accommodating space, and the circuit board is electrically connected to the speaker. A sensing chip is disposed on the circuit board. The sensing structure includes a sensing sound tube and a transmission member. The sensing sound tube protrudes from a front end of the shell and has a conductor. The sensing sound tube is electrically connected to the sensing chip by the transmission member. A material of the sensing sound tube is different from a material of the shell.
Claims12
An in-ear headphone, comprising:
- a shell, internally comprising an accommodating space;
- a speaker, disposed in the accommodating space;
- a circuit board, disposed in the accommodating space, electrically connected to the speaker, and provided with a sensing chip;
- a sensing structure, comprising a sensing sound tube and a transmission member, wherein the sensing sound tube protrudes from a front end of the shell and the whole sensing sound tube is a conductor, the sensing sound tube is electrically connected to the sensing chip by the transmission member, and a material of the sensing sound tube is different from a material of the shell,
- wherein the accommodating space is defined with a front cavity and a rear cavity by location of the speaker, the front cavity is communicated with the rear cavity through a guide channel, and pressure of the front cavity is guided to the rear cavity by the guide channel;
- and
- an inner support, disposed in the accommodating space, the speaker is located inside the inner support, and the guide channel is formed in at least one of the inner support and the shell.
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Dependencies are inferred from the claim text.