Method and apparatus for manufacturing led panel

Abstract

A method of manufacturing a light emitting diode (LED) panel including separating a plurality of LED chips from a wafer; mixing the plurality of LED chips; aligning the plurality of LED chips in a predetermined orientation; mounting the plurality of LED chips on a plurality of chip mounting portions of an alignment tray; picking up the plurality of LED chips mounted on the plurality of chip mounting portions of the alignment tray with a vacuum picker using vacuum pressure, each of the LED chips being pulled towards a respective receiving portion of a plurality of receiving portions of the vacuum picker; forming solders on the plurality of LED chips while the plurality of LED chips are disposed in the plurality of receiving portions of the vacuum picker; and releasing the vacuum pressure to mount the plurality of LED chips on a substrate.

Dependencies are inferred from the claim text.