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US 2021/0001652 A1Published application
Head module, head device, and liquid discharge apparatus
AssigneeRicoh Company, Ltd.
InventorsTakashi KINOKUNI, Takeshi MIYAZAKI
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Abstract
A head module includes: a plurality of heads, a base on which the plurality of heads is arrayed in a head array direction, a plurality of individual heatsinks respectively attached to the plurality of heads, and a common heatsink standing on the base, the common heatsink including a connector thermally connected to each of the plurality of individual heatsinks. The connector of the common heatsink is along the head array direction and is adjacent to each of the plurality of individual heatsinks in a direction perpendicular to the head array direction.
Claims10
A head module comprising:
- a plurality of heads;
- a base on which the plurality of heads is arrayed in a head array direction;
- a plurality of individual heatsinks respectively attached to the plurality of heads;
- and
- a common heatsink standing on the base, the common heatsink including a connector thermally connected to each of the plurality of individual heatsinks,
- wherein the connector of the common heatsink is along the head array direction and is adjacent to each of the plurality of individual heatsinks in a direction perpendicular to the head array direction.
3 more elements
Dependencies are inferred from the claim text.