Device, system and method for providing microchannels with porous sidewall structures

A device comprising:

• a package substrate;
• an integrated circuit (IC) die coupled to the package substrate;
• and
• a fluid conduit thermally coupled to the IC die, the fluid conduit comprising:
• a base to conduct heat from the IC die;
• and
• a plurality of microchannels over the base, the plurality of microchannels comprising first ends coupled to an inlet of the fluid conduit, and second ends coupled to an outlet of the fluid conduit, the plurality of microchannels to convey a fluid in parallel over the base, wherein the plurality of microchannels comprises a first microchannel and a second microchannel in fluid communication with each other through one or more pores of a sidewall structure therebetween.

A system comprising:

• an integrated circuit (IC) die;
• a fluid conduit thermally coupled to the IC die, the fluid conduit comprising:
• a base to conduct heat from the IC die;
• and
• a plurality of microchannels over the base, the plurality of microchannels comprising first ends coupled to an inlet of the fluid conduit, and second ends coupled to an outlet of the fluid conduit, the plurality of microchannels to convey a fluid in parallel over the base, wherein the plurality of microchannels comprises a first microchannel and a second microchannel in fluid communication with each other through one or more pores of a sidewall structure therebetween;
• and
• a display device coupled to the IC die, the display device to display an image based on a signal from the IC die.