# US 2020/0404789 A1 · Wiring board including metal piece and method for manufacturing wiring board including metal piece

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- Number: US 2020/0404789 A1
- Document ID: US20200404789A1
- Status: Published application
- Kind: A1
- Application number: 16/975,937
- Filed: 2019-02-12
- Published: 2020-12-24
- Earliest claimed: 2018-02-28
- Assignees: Fujikura Ltd.
- Applicants: Fujikura Ltd.
- Inventors: Takaharu Hondo
- Web page: https://patentgrep.com/patent/US20200404789A1

## CPC

- H05K 1/118: {specially for flexible printed circuits, e.g. using folded portions}
- H05K 3/328: by welding
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H05K 3/365: {by abutting, i.e. without alloying process}
- H05K 1/0281: {Reinforcement details thereof}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 2201/0133: Elastomeric or compliant polymer
- H05K 2201/0141: Liquid crystal polymer [LCP]
- H05K 2201/0154: Polyimide
- H05K 2201/0394: Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
- H05K 2203/0278: Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
- H05K 2203/0285: Using ultrasound, e.g. for cleaning, soldering or wet treatment
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A wiring board includes: a flexible printed circuit board that includes: a base having a first opening; a wiring pattern formed on the base; and a cover lay that includes an adhesive layer adhering to the wiring pattern and that has a second opening; and a metal cover that covers at least a part of the first opening from below. The wiring pattern contacts the metal cover through the first opening, and is bonded to the metal cover. At least a part of the second opening overlaps the first opening in a plan view. A part of the cover lay overlaps the first opening in a plan view.

## Claims

### Claim 1

A wiring board comprising:
a flexible printed circuit board that comprises:
a base having a first opening;
a wiring pattern formed on the base; and
a cover lay that comprises an adhesive layer adhering to the wiring pattern and that has a second opening; and
a metal cover that covers at least a part of the first opening from below, wherein
the wiring pattern contacts the metal cover through the first opening, and is bonded to the metal cover,
at least a part of the second opening overlaps the first opening in a plan view of the wiring board, and
a part of the cover lay overlaps the first opening in the plan view.

### Claim 2

A wiring board comprising:
a flexible printed circuit board that comprises:
a lower cover lay having a first opening;
an upper cover lay having a second opening; and
a wiring pattern disposed between the lower cover lay and the upper cover lay; and
a metal cover that covers at least a part of the first opening from below, wherein
the wiring pattern contacts the metal cover through the first opening, and is bonded to the metal cover,
the lower cover lay comprises:
a lower adhesive layer contacting the wiring pattern; and
a lower film adhered to the wiring pattern via the lower adhesive layer, and a part of the first opening is located inside the second opening in a plan view of the wiring board.

### Claim 3 (depends on 2)

The wiring board according to claim 2, wherein an elastic modulus of the lower adhesive layer is smaller than an elastic modulus of the lower film.

### Claim 4 (depends on 2)

The wiring board according to claim 2, wherein
the upper cover lay comprises:
an upper adhesive layer that contacts the wiring pattern; and
an upper film adhered to the wiring pattern via the upper adhesive layer.

### Claim 5 (depends on 1)

The wiring board according to claim 1, wherein a laminating order of the flexible printed circuit board in a height direction is symmetrical with respect to the wiring pattern.

### Claim 6

A method for manufacturing a wiring board, the method comprising:
preparing a flexible printed circuit board that comprises:
a base having a first opening;
a cover lay having a second opening; and
a wiring pattern sandwiched between the base and the cover lay;
pressing the wiring pattern through the second opening by a bonding tool, and deforming the wiring pattern toward a metal cover; and
bonding together the wiring pattern and the metal cover using the bonding tool.

### Claim 7 (depends on 2)

The wiring board according to claim 2, wherein a laminating order of the flexible printed circuit board in a height direction is symmetrical with respect to the wiring pattern.