# US 2020/0404784 A1 · Micro-roughened electrodeposited copper foil and copper clad laminate

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- Number: US 2020/0404784 A1
- Document ID: US20200404784A1
- Status: Published application
- Kind: A1
- Application number: 16/899,630
- Filed: 2020-06-12
- Published: 2020-12-24
- Earliest claimed: 2019-06-19
- Assignees: Co-Tech Development Corp.
- Applicants: Co-Tech Development Corp.
- Inventors: Yun-Hsing SUNG; Shih-Shen LEE; Hung-Wei HSU; Chun-Yu KAO
- Web page: https://patentgrep.com/patent/US20200404784A1

## CPC

- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 3/384: {by plating}
- B32B 3/30: characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)}
- B32B 5/022: {Non-woven fabric}
- B32B 5/024: {Woven fabric}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 15/04: comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)}
- B32B 15/12: of paper or cardboard
- B32B 15/14: next to a fibrous or filamentary layer
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- H05K 3/383: {by microetching}
- B32B 2250/02: 2 layers
- B32B 2255/06: on metal layer
- B32B 2255/205: Metallic coating
- B32B 2260/021: Fibrous or filamentary layer
- B32B 2260/028: Paper layer
- B32B 2260/046: Synthetic resin
- B32B 2262/101: Glass fibres
- B32B 2307/204: Di-electric
- B32B 2307/538: Roughness
- B32B 2307/748: Releasability
- B32B 2457/00: Electrical equipment
- B32B 2457/08: PCBs, i.e. printed circuit boards
- H05K 1/0242: {Structural details of individual signal conductors, e.g. related to the skin effect}
- H05K 3/025: {by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper}
- H05K 2201/0248: Needles or elongated particles; Elongated cluster of chemically bonded particles
- H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

## Abstract

Provided is a micro-roughened electrodeposited copper foil, which comprises a micro-rough surface and multiple copper nodules. The micro-rough surface includes multiple copper nodule-free areas and copper nodule-arranged areas. The micro-rough surface of 120 μm2 has at least five copper nodule-free areas of 62500 nm2 or more. Each copper nodule-arranged area has a length of 300 nm to 2500 nm and includes three to fifty copper nodules with a mean width of 10 nm to 300 nm. Besides, the micro-roughened electrodeposited copper foil has an Rlr value of 1.05 to 1.60, or an Sdr of 0.01 to 0.08. With the surface profile and/or characteristics, the electron path distance can be shortened, such that the micro-roughened electrodeposited copper foil can reduce the insertion loss of the copper clad laminate at high frequencies and have the desired peel strength.

## Claims

### Claim 1

A micro-roughened electrodeposited copper foil, comprising:
a micro-rough surface, having multiple copper nodule-free areas and multiple copper nodule-arranged areas, in which part of the copper nodule-free areas are dispersed among the copper nodule-arranged areas;
multiple copper nodules, being formed on the micro-rough surface and located in the copper nodule-arranged areas, in which the copper nodules are not located in the copper nodule-free areas, and the copper nodules in each copper nodule-arranged area are arranged and formed along a direction on the micro-rough surface;
wherein, in the micro-rough surface of 120 μm2, the number of the copper nodule-free areas is 5 or higher, each copper nodule-free area has a size of 62500 nm2 or higher, each copper nodule-arranged area has a length of 300 nm to 2500 nm, the copper nodules in each copper nodule-arranged area have a mean width of 10 nm to 300 nm, and the number of the copper nodules in each copper nodule-arranged area is 3 to 50.

### Claim 2 (depends on 1)

The micro-roughened electrodeposited copper foil as claimed in claim 1, wherein the number of the copper nodule-free areas is 10 to 100.

### Claim 3 (depends on 1)

The micro-roughened electrodeposited copper foil as claimed in claim 1, wherein the size of each copper nodule-free area is 250 nm×250 nm or higher.

### Claim 4 (depends on 1)

The micro-roughened electrodeposited copper foil as claimed in claim 1, wherein the size of each copper nodule-free area is 500 nm×250 nm or higher; and, in the micro-rough surface of 120 μm2, the number of the copper nodule-free areas having a size of 500 nm×250 nm or higher is 10 to 50.

### Claim 5 (depends on 1)

The micro-roughened electrodeposited copper foil as claimed in claim 1, wherein the copper nodules in each copper nodule-arranged area have a mean width of 10 nm to 200 nm.

### Claim 6 (depends on 5)

The micro-roughened electrodeposited copper foil as claimed in claim 5, wherein the number of the copper nodules in each copper nodule-arranged area is 3 to 10.

### Claim 7

A micro-roughened electrodeposited copper foil comprising a micro-rough surface, wherein the micro-rough surface has an Rlr value of 1.05 to 1.60.

### Claim 8 (depends on 7)

The micro-roughened electrodeposited copper foil as claimed in claim 7, wherein the micro-rough surface has an Sdr value of 0.01 to 0.08.

### Claim 9 (depends on 7)

The micro-roughened electrodeposited copper foil as claimed in claim 7, wherein the micro-rough surface has an Rlr value of 1.10 to 1.30, and the micro-rough surface has an Sdr value of 0.010 to 0.023.

### Claim 10

A micro-roughened electrodeposited copper foil comprising a micro-rough surface, wherein the micro-rough surface has an Sdr value of 0.01 to 0.08.

### Claim 11 (depends on 1)

A copper clad laminate, comprising the micro-roughened electrodeposited copper foil as claimed in claim 1, and a substrate; wherein the substrate and the micro-roughened electrodeposited copper foil are laminated.

### Claim 12 (depends on 11)

The copper clad laminate as claimed in claim 11, wherein the copper clad laminate has an insertion loss at 4 GHz of −0.26 dB/in to −0.32 dB/in.

### Claim 13 (depends on 11)

The copper clad laminate as claimed in claim 11, wherein the copper clad laminate has an insertion loss at 8 GHz of −0.41 dB/in to −0.51 dB/in.

### Claim 14 (depends on 11)

The copper clad laminate as claimed in claim 11, wherein the copper clad laminate has an insertion loss at 12.89 GHz of −0.57 dB/in to −0.73 dB/in.

### Claim 15 (depends on 11)

The copper clad laminate as claimed in claim 11, wherein the copper clad laminate has an insertion loss at 16 GHz of −0.67 dB/in to −0.83 dB/in.

### Claim 16 (depends on 7)

A copper clad laminate, comprising the micro-roughened electrodeposited copper foil as claimed in claim 7, and a substrate; wherein the substrate and the micro-roughened electrodeposited copper foil are laminated.

### Claim 17 (depends on 16)

The copper clad laminate as claimed in claim 16, wherein the copper clad laminate has an insertion loss at 4 GHz of −0.26 dB/in to −0.32 dB/in.

### Claim 18 (depends on 16)

The copper clad laminate as claimed in claim 16, wherein the copper clad laminate has an insertion loss at 8 GHz of −0.41 dB/in to −0.51 dB/in.

### Claim 19 (depends on 16)

The copper clad laminate as claimed in claim 16, wherein the copper clad laminate has an insertion loss at 12.89 GHz of −0.57 dB/in to −0.73 dB/in.

### Claim 20 (depends on 16)

The copper clad laminate as claimed in claim 16, wherein the copper clad laminate has an insertion loss at 16 GHz of −0.67 dB/in to −0.83 dB/in.

### Claim 21 (depends on 10)

A copper clad laminate, comprising the micro-roughened electrodeposited copper foil as claimed in claim 10, and a substrate; wherein the substrate and the micro-roughened electrodeposited copper foil are laminated.

### Claim 22 (depends on 21)

The copper clad laminate as claimed in claim 21, wherein the copper clad laminate has an insertion loss at 4 GHz of −0.26 dB/in to −0.32 dB/in.

### Claim 23 (depends on 21)

The copper clad laminate as claimed in claim 21, wherein the copper clad laminate has an insertion loss at 8 GHz of −0.41 dB/in to −0.51 dB/in.

### Claim 24 (depends on 21)

The copper clad laminate as claimed in claim 21, wherein the copper clad laminate has an insertion loss at 12.89 GHz of −0.57 dB/in to −0.73 dB/in.

### Claim 25 (depends on 21)

The copper clad laminate as claimed in claim 21, wherein the copper clad laminate has an insertion loss at 16 GHz of −0.67 dB/in to −0.83 dB/in.