# US 2020/0403299 A1 · Antenna in package device having substrate stack

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- Number: US 2020/0403299 A1
- Document ID: US20200403299A1
- Status: Published application
- Kind: A1
- Application number: 16/447,419
- Filed: 2019-06-20
- Published: 2020-12-24
- Earliest claimed: 2019-06-20
- Assignees: Texas Instruments Incorporated
- Applicants: Texas Instruments Incorporated
- Inventors: Vikas Gupta; Athena Lin; Juan Alejandro Herbsommer
- Web page: https://patentgrep.com/patent/US20200403299A1

## CPC

- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H10W 70/685: comprising multiple insulating layers
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/24: with receiving set
- H04B 1/40: Circuits
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/692: Ceramics or glasses
- H10W 70/695: Organic materials
- H10W 74/016: {using moulds}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 90/00: Package configurations
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 44/209: {Vertical interconnections, e.g. vias}
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10W 44/248: {for antennas}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/63: Vias, e.g. via plugs
- H10W 70/635: {Through-vias}
- H10W 72/07232: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07254: {changes in dispositions}
- H10W 72/073: {of die-attach connectors}
- H10W 72/222: {Multilayered bumps, e.g. a coating on top and side surfaces of a bump core}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/247: {Dispositions of multiple bumps}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H04B: TRANSMISSION

## Abstract

An antenna-in-package (AiP) device includes a substrate stack having a ceramic substrate attached to an organic substrate, where a dielectric constant of the ceramic substrate is higher than a dielectric constant of the organic substrate. An antenna is on a top side of the ceramic substrate. An integrated circuit (IC) die is flip chip attached to a bottom side of the ceramic substrate or to a top surface of the organic substrate. The IC die includes a radio circuit including at least a transmitter, and there is at least one interconnect for coupling the radio circuit to the antenna.

## Claims

### Claim 1

An antenna-in-package (AiP) device, comprising:
a substrate stack comprising a ceramic substrate attached to an organic substrate, wherein a dielectric constant of the ceramic substrate is higher as compared to a dielectric constant of the organic substrate;
an antenna on a top side of the ceramic substrate, and
integrated circuit (IC) die positioned between the ceramic substrate and the organic substrate,
a mold compound that fills a gap between the ceramic substrate and the organic substrate,
wherein the IC die includes a radio circuit comprising at least a transmitter and the ceramic substrate includes at least one interconnect for coupling the radio circuit to the antenna.

### Claim 2 (depends on 1)

The AiP device of claim 1, wherein the IC die is flip chip attached to a bottom side of the ceramic substrate.

### Claim 3 (depends on 1)

The AiP device of claim 1, wherein the IC die is flip chip attached to a top surface of the organic substrate.

### Claim 4 (depends on 1)

The AiP device of claim 1, wherein the organic substrate comprises a multi-level organic substrate, wherein the multi-level organic substrate further comprises at least one embedded IC or an embedded passive circuit.

### Claim 5 (depends on 1)

The AiP device of claim 1, wherein the organic substrate is thicker as compared to a thickness of the ceramic substrate.

### Claim 6 (depends on 1)

The AiP device of claim 1, wherein the dielectric constant of the ceramic substrate is at least 3 times higher as compared to the dielectric constant of the organic substrate.

### Claim 7 (depends on 1)

The AiP device of claim 1, wherein the transmitter comprises a transceiver.

### Claim 8 (depends on 1)

The AiP device of claim 1, further comprising a ball grid array (BGA) on a bottom side of the AiP device.

### Claim 9 (depends on 1)

The AiP device of claim 1, further comprising a metal reflector on an opposite side of the ceramic substrate below the antenna.

### Claim 10 (depends on 1)

The AiP device of claim 1, further comprising a millimeter-wave filter coupled to the antenna.

### Claim 11

A method forming an antenna-in-package (AiP) device, comprising:
providing a ceramic substrate with a top side having an antenna disposed thereon attached to an organic substrate, wherein a dielectric constant of the ceramic substrate is higher as compared to a dielectric constant of the organic substrate, with one of the ceramic substrate and the organic substrate having metal balls thereon, wherein the ceramic substrate includes at least one interconnect for coupling a radio circuit to the antenna;
flip chip die attaching an integrated circuit (IC) die having the radio circuit comprising at least a transmitter to another of the ceramic substrate and the organic substrate;
thermal compression bonding the organic substrate to the ceramic substrate so that the metal balls attach the ceramic substrate to the organic substrate, and
molding to form a mold compound that fills a gap between the ceramic substrate and the organic substrate.

### Claim 12 (depends on 11)

The method of claim 11, wherein the flip chip die attaching comprises attaching the IC die to a bottom side of the ceramic substrate.

### Claim 13 (depends on 11)

The method of claim 11, wherein the flip chip die attaching comprises attaching the IC die to a top side of the organic substrate.

### Claim 14 (depends on 11)

The method of claim 11, further comprising forming a ball grid array (BGA) on a bottom side of the AiP device.

### Claim 15 (depends on 11)

The method of claim 11, wherein the organic substrate comprises a multi-level organic substrate that further comprises at least one embedded IC or an embedded passive device.

### Claim 16 (depends on 11)

The method of claim 11, wherein the organic substrate is thicker as compared to a thickness of the ceramic substrate.

### Claim 17 (depends on 11)

The method of claim 11, wherein the dielectric constant of the ceramic is at least 3 times higher as compared to the dielectric constant of the organic substrate.

### Claim 18 (depends on 11)

The method of claim 11, wherein the ceramic substrate further comprises a reflector on an opposite side of the ceramic substrate below the antenna.

### Claim 19 (depends on 11)

The method of claim 11, wherein the ceramic substrate further comprises a millimeter-wave filter coupled to the antenna.

### Claim 20 (depends on 11)

The method of claim 11, wherein the transmitter comprises a transceiver.