# US 2020/0403293 A1 · Network on interconnect fabric and integrated antenna > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0403293 A1 - Document ID: US20200403293A1 - Status: Published application - Kind: A1 - Application number: 17/013,166 - Filed: 2020-09-04 - Published: 2020-12-24 - Earliest claimed: 2018-03-06 - Assignees: The Regents of the University of California - Applicants: The Regents of the University of California - Inventors: Boris Vaisband; Subramanian S. Iyer; Adeel A. Bajwa; Arpan Dasgupta; Arsalan Alam - Web page: https://patentgrep.com/patent/US20200403293A1 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H10W 70/698: Semiconductor materials that are electrically insulating, e.g. undoped silicon - H01Q 9/0407: {Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40)} - H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them - H10W 40/253: {Semiconductors} - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 70/611: {for connecting multiple chips together} - H10W 70/635: {Through-vias} - H10W 72/00: Interconnections or connectors in packages - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A system is provided for interconnecting multiple functional dies on a single substrate, including: (1) multiple global links in the substrate; (2) multiple local links in the substrate; and (3) multiple utility dies on the substrate, wherein each of the utility dies is connected to at least one of the global links, the utility dies are configured to communicate with one another through the global links, each of the utility dies is connected to at least one of the local links and is configured to communicate with at least one of the functional dies through the at least one of the local links. In some embodiments, an antenna is integrated into the substrate. ## Claims ### Claim 1 A system for interconnecting a plurality of functional dies on a single substrate, comprising: a plurality of global links in the substrate; a plurality of local links in the substrate; and a plurality of utility dies on the substrate, wherein each of the utility dies is connected to at least one of the global links, the utility dies are configured to communicate with one another through the global links, each of the utility dies is connected to at least one of the local links and is configured to communicate with at least one of the functional dies through the at least one of the local links. ### Claim 2 (depends on 1) The system of claim 1, wherein each of the utility dies includes an input queue to receive incoming data from one or more of the global links and one or more of the local links, and includes a multiplexer to provide outgoing data to one or more of the global links and one or more of the local links. ### Claim 3 (depends on 2) The system of claim 2, wherein each of the utility dies includes a processing core configured to direct operation of the input queue and the multiplexer to route incoming data received by the input queue to a selected link through the multiplexer. ### Claim 4 (depends on 3) The system of claim 3, wherein the processing core is configured to route the incoming data to the selected link according to a priority assigned to the incoming data. ### Claim 5 (depends on 3) The system of claim 3, wherein each of the utility dies includes a set of repeater circuits connected between the input queue and the multiplexer. ### Claim 6 (depends on 5) The system of claim 5, wherein the processing core is configured to route the incoming data received by the input queue to the multiplexer via the set of repeater circuits. ### Claim 7 (depends on 6) The system of claim 6, wherein the incoming data is received from a source functional die connected to the input queue, and the processing core is configured to route the incoming data to a destination functional die connected to the multiplexer. ### Claim 8 (depends on 1) The system of claim 1, wherein each of the utility dies includes a power regulation circuit configured to regulate a received voltage to a local voltage to be supplied to at least one of the functional dies disposed adjacent to the utility die. ### Claim 9 (depends on 8) The system of claim 8, wherein each of the utility dies includes a power management circuit connected to the power regulation circuit. ### Claim 10 (depends on 9) The system of claim 9, wherein each of the utility dies includes a plurality of power regulation circuits to supply respective, different local voltages, and the power management circuit is connected to the power regulation circuits. ### Claim 11 (depends on 9) The system of claim 9, wherein each of the utility dies includes a power-gating circuit connected to the power management circuit. ### Claim 12 (depends on 9) The system of claim 9, wherein each of the utility dies includes a decoupling capacitor connected to the power management circuit. ### Claim 13 (depends on 1) The system of claim 1, wherein each of the utility dies includes a clock circuit configured to generate a local clock signal to be supplied to at least one of the functional dies disposed adjacent to the utility die. ### Claim 14 (depends on 1) The system of claim 1, wherein each of the utility dies includes a plurality of clock circuits to supply respective, different local clock signals. ### Claim 15 (depends on 1) The system of claim 1, wherein each of the utility dies includes a built-in self-test circuit configured to perform tests of the system. ### Claim 16 (depends on 1) The system of claim 1, wherein the utility dies are configured to perform redundancy allocation in an event of a failure of one of the utility dies or one of the functional dies. ### Claim 17 A system comprising: a single substrate to accommodate a plurality of functional dies on the substrate, wherein the substrate includes: a plurality of global links in the substrate, and a plurality of local links in the substrate; and a plurality of utility dies on the substrate, wherein each of the utility dies is connected to at least one of the global links, the utility dies are configured to communicate with one another through the global links, each of the utility dies is connected to at least one of the local links and is configured to communicate with at least one of the functional dies through the at least one of the local links. ### Claim 18 (depends on 17) The system of claim 17, wherein the substrate is a silicon substrate. ### Claim 19 (depends on 17) The system of claim 17, wherein each of the utility dies includes: an input queue to receive incoming data from one or more of the global links and one or more of the local links, a multiplexer to provide outgoing data to one or more of the global links and one or more of the local links, and a processing core configured to direct operation of the input queue and the multiplexer to route incoming data received by the input queue to a selected link through the multiplexer. ### Claim 20 (depends on 17) The system of claim 17, wherein each of the utility dies includes a power regulation circuit configured to regulate a received voltage to a local voltage to be supplied to at least one of the functional dies disposed adjacent to the utility die. ### Claim 21 A system for interconnecting a plurality of components on a single substrate, comprising: a plurality of global links in the substrate; a plurality of local links in the substrate; a plurality of utility dies on the substrate, wherein each of the utility dies is connected to at least one of the global links, the utility dies are configured to communicate with one another through the global links, each of the utility dies is connected to at least one of the local links and is configured to communicate with at least one of the functional dies through the at least one of the local links; and an antenna integrated on the substrate. ### Claim 22 (depends on 21) The system of claim 21, wherein the antenna is integrated via a fused silica substrate technique. ### Claim 23 (depends on 21) The system of claim 21, wherein the antenna is integrated via a PDMS substrate technique. ### Claim 24 (depends on 21) The system of claim 21, wherein the antenna is a patch antenna.