# US 2020/0403185 A1 · Semiconductor device

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- Number: US 2020/0403185 A1
- Document ID: US20200403185A1
- Status: Published application
- Kind: A1
- Application number: 17/015,145
- Filed: 2020-09-09
- Published: 2020-12-24
- Earliest claimed: 2014-06-25
- Assignees: Japan Display Inc.
- Applicants: Japan Display Inc.
- Inventors: Jun FUJIYOSHI; Kazuto TSURUOKA
- Web page: https://patentgrep.com/patent/US20200403185A1

## CPC

- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- H10K 59/873: {Encapsulations}
- H10K 77/111: {Flexible substrates}
- H10K 59/1201: {Manufacture or treatment}
- H10K 59/871: {Self-supporting sealing arrangements}
- H10K 71/80: using temporary substrates
- H10K 2102/311: {Flexible OLED}
- Y02E 10/549: Organic PV cells
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

The aim is to improve the bending resistance a display device. The display device in one embodiment includes a substrate including a first surface and a second surface and a curved part between the first surface and the second surface, a display element arranged on the first surface, a conducting layer connected with the display element and extending to the second surface from the first surface via the curved part, a plurality of protective layers having a lower ductility than the substrate and arranged in the substrate side and/or opposite side to the substrate side with respect to the conducting layer and along the curved part, wherein each of the plurality of protective layers spreading over the curved part, to a certain region of the first surface side from the curved part, and to a certain region of the second side from the curved part.

## Claims

### Claim 1

A semiconductor device comprising:
a substrate including a first portion, a second portion, and a curved portion between the first portion and the second portion;
a thin film transistor arranged on the first portion;
a conducting layer connected with the thin film transistor and extending to the second portion from the first portion via the curved portion; and
a first organic protective layer arranged in the curved portion, wherein
the second conductive layer is arranged on the first organic protective layer so that the first organic protective layer is sandwiched by the first conductive layer and the second conductive layer in the curved portion,
the first conductive layer is directly in contact with the second conductive layer in the first portion and the second portion, and
the first conductive layer and the second conductive layer are separated by the first organic protective layer in the curved portion.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, further comprising a second organic protective layer arranged on the second conductive layer in the curved portion.

### Claim 3 (depends on 2)

The semiconductor device according to claim 2, wherein a first part of the second organic protective layer covers a first inclined portion of the first organic protective layer, and
a second part of the second organic protective layer covers a second inclined portion of the first organic protective layer.

### Claim 4 (depends on 1)

The semiconductor device according to claim 1, wherein the conducting layer includes a metal oxide.

### Claim 5 (depends on 1)

The semiconductor device according to claim 1, wherein the substrate and the first organic protective layer are organic resins.

### Claim 6 (depends on 1)

The semiconductor device according to claim 1, wherein the substrate is polyimide, and
the first organic protective layer is acrylic resin.