# US 2020/0403142 A1 · Piezoelectric transducer array fabrication > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0403142 A1 - Document ID: US20200403142A1 - Status: Published application - Kind: A1 - Application number: 16/446,424 - Filed: 2019-06-19 - Published: 2020-12-24 - Earliest claimed: 2019-06-19 - Assignees: uBeam Inc. - Applicants: uBeam Inc. - Inventors: Iman Shahosseini; Trevor Niblock; Wade Smith; Henry Tri; Richard Agbulos; Bo Pham - Web page: https://patentgrep.com/patent/US20200403142A1 ## CPC - B06B 1/0622: {on one surface} - H10N 30/071: Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate - H10N 30/03: Assembling devices that include piezoelectric or electrostrictive parts - H10N 30/073: by fusion of metals or by adhesives - H10N 30/088: by cutting or dicing - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract Systems and techniques are provided for piezoelectric transducer array fabrication. A sheet of piezoelectric material may be diced into pieces of piezoelectric material. A sheet of elastic layer material may be spin coated with adhesive. The pieces of piezoelectric material may be placed onto the sheet of elastic layer material. Pressure may be applied to the pieces of piezoelectric material and the sheet of elastic layer material. The adhesive may be cured. Transduction elements may be cut from the pieces of piezoelectric material and the sheet of elastic layer material. Electronics may be mounted on a PCB mounting board. Adhesive may be applied onto the PCB mounting board. The transduction elements may be mounted on the PCB mounting board. A spacer may be mounted on the PCB mounting board. Adhesive may be applied onto the spacer and the transduction elements. Diaphragms may be mounted on the spacer. ## Claims ### Claim 1 A method for piezoelectric transducer array fabrication comprising: dicing a sheet of piezoelectric material into pieces of piezoelectric material; spin coating a sheet of elastic layer material with adhesive; placing the pieces of piezoelectric material onto the sheet of elastic layer material; applying pressure to the pieces of piezoelectric material and the sheet of elastic layer material and curing the adhesive; cutting transduction elements from the pieces of piezoelectric material and the sheet of elastic layer material; mounting electronics on a PCB mounting board comprising traces and vias; applying adhesive onto the PCB mounting board; mounting the transduction elements on the PCB mounting board; mounting a spacer on the PCB mounting board; applying adhesive onto the spacer and the transduction elements; and mounting diaphragms on the spacer. ### Claim 2 (depends on 1) The method of claim 1, further comprising: applying adhesive onto the diaphragms; and mounting waveguides on the diaphragms. ### Claim 3 (depends on 2) The method of claim 2, wherein protection grids are attached to the waveguides. ### Claim 4 (depends on 1) The method of claim 1, wherein the adhesive applied onto the PCB mounting board is electrically conductive. ### Claim 5 (depends on 1) The method of claim 1, wherein each of the transduction elements is mounted on the PCB mounting board to cover one via of the PCB mounting board. ### Claim 6 (depends on 1) The method of claim 1, wherein the spacer comprises vias that are aligned with vias of the PCB mounting board when the spacer is mounted on the PCB mounting board. ### Claim 7 (depends on 1) The method of claim 1, wherein each of the diaphragms comprises a cup that is mounted on one of the transduction elements when the diaphragms are mounted on the spacer. ### Claim 8 (depends on 1) The method of claim 1, wherein the diaphragms comprise an electrically conductive material. ### Claim 9 A method for piezoelectric transducer array fabrication comprising: applying adhesive onto a PCB mounting board comprising vias, wherein the adhesive is electrically conductive; and mounting transduction elements to the PCB mounting board such that each of the transduction elements covers one of the vias on the PCB mounting board, wherein each of the transduction elements comprises a bimorph with an elastic layer adhered to a piece of piezoelectric material. ### Claim 10 (depends on 9) The method of claim 9, further comprising: applying adhesive onto a spacer; mounting diaphragms on the spacer; applying adhesive onto either or both of the transduction elements and the bottoms of cups of the diaphragms; applying adhesive to one or both of the bottom of the spacer and the PCB mounting board; and mounting the spacer with the diaphragms on the PCB mounting board. ### Claim 11 (depends on 10) The method of claim 10, further comprising: applying adhesive onto perimeters of the diaphragms; and mounting waveguides on the diaphragms. ### Claim 12 (depends on 9) The method of claim 9, further comprising: applying adhesive onto the transduction elements; and mounting a spacer/diaphragm component on the PCB mounting board and the transduction elements, wherein the spacer/diaphragm component comprises a spacer and diaphragms as a single integral component. ### Claim 13 (depends on 9) The method of claim 9, further comprising: mounting a spacer on the PCB mounting board; applying adhesive onto the spacer and the transduction elements; and mounting a diaphragm/waveguide component on the spacer and the transduction elements, wherein the diaphragm/waveguide component comprises diaphragms and waveguides as a single integral component. ### Claim 14 A method for piezoelectric transducer array fabrication comprising: mounting electronics on a PCB mounting board comprising traces and vias; applying adhesive onto the PCB mounting board; mounting transduction elements on the PCB mounting board; mounting a spacer on the PCB mounting board using either adhesive applied to the PCB mounting board or adhesive applied to the bottom of the spacer; applying adhesive onto the spacer and the transduction elements; and mounting diaphragms on the spacer and the transduction elements. ### Claim 15 (depends on 14) The method of claim 14, further comprising, before mounting the transduction elements to the PCB mounting board: dicing a sheet of piezoelectric material into pieces of piezoelectric material; coating a sheet of elastic layer material with adhesive; placing the pieces of piezoelectric material onto the sheet of elastic layer material; applying pressure to the pieces of piezoelectric material and the sheet of elastic layer material and curing the adhesive; cutting the transduction elements from the pieces of piezoelectric material and the sheet of elastic layer material; ### Claim 16 (depends on 15) The method of claim 15, wherein cutting the transduction elements from the pieces of piezoelectric material and the sheet of elastic layer material comprising laser cutting or chemically etching the sheet of elastic layer material in a shape around each piece of the pieces of piezoelectric material. ### Claim 17 (depends on 14) The method of claim 14, further comprising: applying adhesive onto perimeters of the diaphragms; and mounting waveguides on the diaphragms. ### Claim 18 (depends on 14) The method of claim 14, wherein the diaphragms comprise a single integral component. ### Claim 19 (depends on 14) The method of claim 14, wherein the spacer comprises walls forming patterned cells that fit around the transduction elements on the PCB mounting board. ### Claim 20 (depends on 14) The method of claim 14, wherein each transduction element covers a via of the PCB mounting board and wherein the spacer cover a via of the PCB mounting board for each transduction element on the PCB mounting board.