# US 2020/0403133 A1 · Quantum dot led package and quantum dot led module including the same

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- Number: US 2020/0403133 A1
- Document ID: US20200403133A1
- Status: Published application
- Kind: A1
- Application number: 16/632,513
- Filed: 2019-03-12
- Published: 2020-12-24
- Earliest claimed: 2018-09-13
- Assignees: Lumens Co., Ltd.
- Applicants: Lumens Co., Ltd.
- Inventors: Sunghwan YOO; Dohyoung KANG; Sungsik JO
- Web page: https://patentgrep.com/patent/US20200403133A1

## CPC

- H10H 20/8582: {characterised by their shape}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8583: {not being in contact with the bodies}
- H10W 72/0198: {batch processes}
- H10W 90/00: Package configurations
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2201/10977: Encapsulated connections
- H10H 20/0362: {of encapsulations}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/0364: {of interconnections}
- H10H 20/0365: {of means for heat extraction or cooling}
- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/853: characterised by their shape
- H10H 20/858: Means for heat extraction or cooling
- H10H 20/8581: {characterised by their material}
- H10W 72/01255: {by using masks}
- H10W 72/013: {of die-attach connectors}
- H10W 72/072: {of bump connectors}
- H10W 72/07231: {Techniques}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/07352: {changes in structures or sizes}
- H10W 72/07353: {changes in shapes}
- H10W 72/07354: {changes in dispositions}
- H10W 72/225: {Bumps having a filler embedded in a matrix}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/253: {not comprising solid metals or solid metalloids, e.g. polymers or ceramics}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/334: {Cross-sectional shape, i.e. in side view}
- H10W 72/347: {Dispositions of multiple die-attach connectors}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/925: {Bond pads having a filler embedded in a matrix}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 72/953: {not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 76/10: Containers or parts thereof
- H10W 80/023: {Applying a coating on the bonding area}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A quantum dot LED package is disclosed. The quantum dot LED package includes: a heat dissipating reflector having a through cavity; a quantum dot plate accommodated in the upper portion of the through cavity; an LED chip accommodated in the lower portion of the through cavity and whose top surface is coupled to the lower surface of the quantum dot plate; electrode pads disposed on the lower surface of the LED chip and protruding more downward than the lower surface of the heat dissipating reflector; and a resin part formed in the through cavity to fix between the LED chip and the reflector and between the quantum dot plate and the reflector.

## Claims

### Claim 1

A quantum dot LED package comprising:
a metal reflector having a through cavity therein;
a quantum dot plate accommodated in the upper portion of the through cavity;
an LED chip accommodated in the lower portion of the through cavity, located on the lower surface of the quantum dot plate, and having electrode pads disposed on the bottom surface thereof; and
a resin part filled between the side surfaces of the LED chip and the quantum dot plate and the inner walls of the through cavity in a state in which the LED chip and the quantum dot plate are accommodated in the through cavity to fix between the LED chip and the metal reflector and between the quantum dot plate and the metal reflector,
wherein the metal reflector has at least two outwardly extending lateral protrusions by which a recess is defined, the upper surface of the quantum dot plate lies in the same plane as the upper surface of the metal reflector, and the lateral protrusions are formed on both opposite side surfaces of the metal reflector.

### Claim 2

(canceled)

### Claim 3

(canceled)

### Claim 4 (depends on 1)

The quantum dot LED package according to claim 1, wherein the electrode pads protrude more downward than the lower surface of the metal reflector.

### Claim 5 (depends on 1)

The quantum dot LED package according to claim 1, wherein the lower surface of the LED chip is located below the lower surface of the metal reflector.

### Claim 6

(canceled)

### Claim 7 (depends on 1)

The quantum dot LED package according to claim 1, wherein the resin part comprises a reflective material.

### Claim 8 (depends on 1)

The quantum dot LED package according to claim 1, wherein the area of the light emitting surface of the quantum dot plate is larger than the contact area of the quantum dot plate with the LED chip.

### Claim 9

A quantum dot LED module comprising:
a bendable PCB; and
a plurality of quantum dot LED packages arrayed on the bendable PCB and each of which comprising a metal reflector having a through cavity therein, a quantum dot plate accommodated in the upper portion of the through cavity, an LED chip accommodated in the lower portion of the through cavity, located on the lower surface of the quantum dot plate, and having a first electrode pad and a second electrode pad disposed on the bottom surface thereof, and a resin part filled between the side surfaces of the LED chip and the quantum dot plate and the inner walls of the through cavity in a state in which the LED chip and the quantum dot plate are accommodated in the through cavity to fix between the LED chip and the metal reflector and between the quantum dot plate and the metal reflector,
wherein the metal reflector has at least two outwardly extending lateral protrusions by which a recess is defined, the recesses of the adjacent metal reflectors abut each other to form a space, the upper surface of the quantum dot plate lies in the same plane as the upper surface of the metal reflector, the lateral protrusions are formed on both opposite side surfaces of the metal reflector, and the space is filled with a heat dissipating material.

### Claim 10

(canceled)

### Claim 11 (depends on 9)

The quantum dot LED module according to claim 9, wherein an opening is formed by a gap between the adjacent metal reflectors to open the space in the lateral directions and the heat dissipating material is diffused into locations covering the side surfaces of the metal reflectors through the opening.

### Claim 12 (depends on 9)

The quantum dot LED module according to claim 9, wherein the heat dissipating material is diffused between the LED chip and the bendable PCB and between the side surfaces of the metal reflector and the bendable PCB through the lower portion of the space.

### Claim 13 (depends on 9)

The quantum dot LED module according to claim 9, wherein one or more Zener diodes are arranged in the space.

### Claim 14 (depends on 9)

The quantum dot LED module according to claim 9, wherein the bendable PCB comprises a heat dissipating metal layer formed of Cu or its alloy, an electrode layer formed with first electrodes corresponding to the first electrode pads and second electrodes corresponding to the second electrode pads, and an intermediate layer interposed between the electrode layer and the heat dissipating metal layer.

### Claim 15 (depends on 9)

The quantum dot LED module according to claim 9, wherein the first electrode pad and the second electrode pad protrude more downward than the lower surface of the metal reflector.

### Claim 16 (depends on 14)

The quantum dot LED module according to claim 14, further comprising first solder joints through which the first electrode pads are bonded to the first electrodes, second solder joints through which the second electrode pads are bonded to the second electrodes, and reinforcing resin parts reinforcing the bonding state of the first electrode pads and the first electrodes through the first solder joints and the bonding state of the second electrode pads and the second electrodes through the second solder joints.

### Claim 17 (depends on 16)

The quantum dot LED module according to claim 16, wherein both the first solder joints and the second solder joints are embedded in the reinforcing resin parts.

### Claim 18 (depends on 16)

The quantum dot LED module according to claim 16, wherein the reinforcing resin parts are formed using a resin material mixed with a plurality of solder balls, and the first solder joints and the second solder joints are formed using a solder cream.

### Claim 19

(canceled)

### Claim 20 (depends on 9)

The quantum dot LED module according to claim 9, wherein the area of the light emitting surface of the quantum dot plate is larger than the contact area of the quantum dot plate with the LED chip.