# US 2020/0402902 A1 · Connection of several circuits of an electronic chip > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0402902 A1 - Document ID: US20200402902A1 - Status: Published application - Kind: A1 - Application number: 16/901,449 - Filed: 2020-06-15 - Published: 2020-12-24 - Earliest claimed: 2019-06-19 - Assignees: STMicroelectronics (Grenoble 2) SAS; STMicroelectronics (Rousset) SAS - Applicants: STMicroelectronics (Grenoble 2) SAS; STMicroelectronics (Rousset) SAS - Inventors: Samuel BOSCHER; Yann REBOURS; Michel CUENCA - Web page: https://patentgrep.com/patent/US20200402902A1 ## CPC - H10W 20/427: {Power or ground buses} - H10W 20/43: Layouts of interconnections - G06F 30/39: Circuit design at the physical level (physical level design for reconfigurable circuits G06F30/347) - G06F 30/394: Routing (G06F30/396 takes precedence) - H10W 20/42: Vias, e.g. via plugs - H10W 72/00: Interconnections or connectors in packages - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract An electronic chip disclosed herein includes a plurality of IP core circuits, with a shared strip that is at least partially conductive and is linked to a node for applying a fixed potential. A plurality of tracks electrically links the plurality of IP core circuits to the shared strip. Each individual track of the plurality of tracks solely links a single one of said IP core circuits to the shared strip. ## Claims ### Claim 1 An electronic chip, comprising: a plurality of IP core circuits; a shared strip that is at least partially conductive and is linked to a node for applying a fixed potential; and a plurality of tracks for electrically linking the plurality of IP core circuits to the shared strip; wherein each individual track of said plurality of tracks solely links a single one of said IP core circuits to the shared strip. ### Claim 2 (depends on 1) The electronic chip according to claim 1, wherein said node is defined by a connection pad of the electronic chip. ### Claim 3 (depends on 1) The electronic chip according to claim 1, wherein the shared strip has an electrical resistance per unit of length lower than that of the tracks. ### Claim 4 (depends on 1) The electronic chip according to claim 1, wherein said plurality of IP core circuits are at least partially analog. ### Claim 5 (depends on 1) The electronic chip according to claim 1, wherein, for each track of said plurality of tracks, the shared strip has a surface with a conductive section larger than that of the track. ### Claim 6 (depends on 1) The electronic chip according to claim 1, wherein, for each track of said plurality of tracks, the shared strip comprises a conductive material having an electrical conductivity greater than that of the track. ### Claim 7 (depends on 1) The electronic chip according to claim 1, wherein the shared strip is comprised of at least one metallic strip. ### Claim 8 (depends on 7) The electronic chip according to claim 7, wherein the at least one metallic strip has a total width greater than that of said tracks. ### Claim 9 (depends on 7) The electronic chip according to claim 7, wherein the at least one metallic strip has a total thickness greater than that of said tracks. ### Claim 10 (depends on 7) The electronic chip according to claim 7, wherein the at least one metallic strip comprises a plurality of metallic strips; and wherein metallic strips that are adjacent and side by side are separated by a distance smaller than a width of the metallic strips. ### Claim 11 (depends on 10) The electronic chip according to claim 10, wherein the distance is less than 30% of a width of the plurality of metallic strips. ### Claim 12 (depends on 10) The electronic chip according to claim 10, wherein at least some metallic strips from among the plurality of said metallic strips are superimposed over one another. ### Claim 13 (depends on 1) The electronic chip according to claim 1, wherein the tracks and the shared strip are located in different levels of metal. ### Claim 14 (depends on 1) The electronic chip according to claim 1, wherein said tracks extend from the shared strip orthogonally thereto. ### Claim 15 (depends on 1) The electronic chip according to claim 1, wherein each of said tracks is linked to the shared strip by at least one via arranged in a matrix. ### Claim 16 An electronic chip, comprising: a plurality of IP core circuits; a conductive strip; and a plurality of tracks for electrically connecting the plurality of IP core circuits to the shared strip; wherein each individual track of said plurality of tracks solely links a single one of said IP core circuits to the shared strip. ### Claim 17 (depends on 16) The electronic chip according to claim 16, wherein the shared strip has an electrical resistance per unit of length lower than that of the tracks. ### Claim 18 (depends on 16) The electronic chip according to claim 16, wherein the shared strip has a surface with a conductive section larger than that of at least one of the plurality of tracks. ### Claim 19 (depends on 16) The electronic chip according to claim 16, wherein the shared strip comprises a conductive material having an electrical conductivity greater than that of at least one of the plurality of tracks.