# US 2020/0402829 A1 · Electrostatic chuck and substrate fixing device

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- Number: US 2020/0402829 A1
- Document ID: US20200402829A1
- Status: Published application
- Kind: A1
- Application number: 16/903,742
- Filed: 2020-06-17
- Published: 2020-12-24
- Earliest claimed: 2019-06-20
- Assignees: Shinko Electric Industries Co., Ltd.
- Applicants: Shinko Electric Industries Co., Ltd.
- Inventors: Michio Horiuchi; Masaya Tsuno
- Web page: https://patentgrep.com/patent/US20200402829A1

## CPC

- H10P 72/722: {Details of electrostatic chucks}
- H01J 37/32082: {Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence)}
- H01J 37/32715: {Workpiece holder}
- H01J 2237/3345: anisotropy
- H10P 72/0421: {for drying etching}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

An electrostatic chuck includes at least one conductor layer; an electrostatic electrode; and a base body in which the electrostatic electrode is embedded, the base body having a first dielectric layer on which the electrostatic electrode is mounted, the base body having a second dielectric layer stacked on the first dielectric layer with covering the electrostatic electrode. The conductor layer is formed on a surface of the first dielectric layer opposite to a surface on which the electrostatic electrode is mounted. The second dielectric layer has a first surface facing the first dielectric layer and a second surface opposite to the first surface, and the second surface is a placement surface on which a suction target is placed. A relative permittivity of the first dielectric layer is lower than a relative permittivity of the second dielectric layer.

## Claims

### Claim 1

An electrostatic chuck comprising:
at least one conductor layer;
an electrostatic electrode; and
a base body in which the electrostatic electrode is embedded, the base body having a first dielectric layer on which the electrostatic electrode is mounted, the base body having a second dielectric layer stacked on the first dielectric layer with covering the electrostatic electrode,
wherein the conductor layer is formed on a surface of the first dielectric layer opposite to a surface on which the electrostatic electrode is mounted,
wherein the second dielectric layer has a first surface facing the first dielectric layer and a second surface opposite to the first surface, and the second surface is a placement surface on which a suction target is placed, and
wherein a relative permittivity of the first dielectric layer is lower than a relative permittivity of the second dielectric layer.

### Claim 2

The electrostatic chuck according to Claim wherein the first dielectric layer and the second dielectric layer are made of ceramic.

### Claim 3 (depends on 2)

The electrostatic chuck according to claim 2, wherein the second dielectric layer has alumina as a main component, and wherein the first dielectric layer has any one of mullite, forsterite steatite and cordierite, as a main component.

### Claim 4 (depends on 2)

The electrostatic chuck according to claim 2, wherein the first dielectric layer and the second dielectric layer have a same material, as a main component, and wherein a porosity of the first dielectric layer is greater than a porosity of the second dielectric layer.

### Claim 5 (depends on 4)

The electrostatic chuck according to claim 4, wherein the second dielectric layer has alumina having a relative density of 92% or greater, as a main component, and wherein the first dielectric layer has alumina having a relative density of 50% or greater and less than 90%, as a main component.

### Claim 6 (depends on 1)

The electrostatic chuck according to claim 1, wherein the conductor layer is an RF electrode.

### Claim 7 (depends on 1)

A substrate fixing device comprising:
a base plate; and
the electrostatic chuck according to claim 1 mounted on one surface of the base plate.