# US 2020/0401867 A1 · Packaging System with Code-Based Detection of Product Falsification > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0401867 A1 - Document ID: US20200401867A1 - Status: Published application - Kind: A1 - Application number: 16/449,242 - Filed: 2019-06-21 - Published: 2020-12-24 - Earliest claimed: 2019-06-21 - Assignees: eTEP Inc. - Applicants: eTEP Inc. - Inventors: Rohinton S. Dehmubed; Peter Gompper - Web page: https://patentgrep.com/patent/US20200401867A1 ## CPC - G06K 19/07722: {the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00)} - G06K 19/07758: {arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag} - G06K 19/07798: {part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers (electronic seals G09F3/03)} - G06Q 30/0609: {Qualifying participants for shopping transactions (payment transaction verification G06Q20/401)} - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - G06Q: INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR ## Abstract A packaging system for at least one article includes a multilayer laminate structure that encapsulates a transformative material between first and second conductive layers where one of the first and second conductive layers defines a set of elongate sections. An NFC/RFID IC is electrically coupled to an antenna. The NFC/RFID IC has a plurality of input terminals electrically coupled to a plurality of electrical circuits that provide for electrical connection or electrical disconnection between sections in the set of elongate sections in accordance with a predefined codeword. The NFC/RFID IC is configured to sense voltage signals produced by the plurality of electrical circuits, determine a sensed codeword based on the sensed voltage signals, compare the sensed codeword to the predefined codeword, and output a signal based on such comparison. The predefined codeword can be associated with the packaging system for the at least one article or the at least one article, and the output signal output can be related to suspected counterfeiting or falsification of the at least one article. The NFC/RFID IC or an additional NFC/RFID IC can be configured to detect and register an intrusion or perforation in the multilayer laminate structure that relates to suspected tampering. ## Claims ### Claim 1 A packaging system for at least one article, comprising: a multilayer laminate structure having a conductive layer that is configured to define a set of elongate sections; and a first NFC/RFID integrated circuit electrically coupled to an antenna, wherein the first NFC/RFID integrated circuit has a plurality of input terminals electrically coupled to a plurality of electrical circuits that provide for electrical connection or electrical disconnection between sections in the set of elongate sections in accordance with a predefined codeword; wherein the first NFC/RFID integrated circuit is configured to sense voltage signals produced by the plurality of electrical circuits, determine a sensed codeword based on the sensed voltage signals, compare the sense codeword to the predefined codeword, and output a signal based on such comparison. ### Claim 2 (depends on 1) The packaging system of claim 1, wherein: the plurality of electrical circuits includes at least one trace of conductive material or other conductor that provides for electrical connection between adjacent sections in accordance with a predefined codeword. ### Claim 3 (depends on 1) The packaging system of claim 1, wherein: the conductive material is provided by the same conductive layer that forms the elongate sections of the set. ### Claim 4 (depends on 1) The packaging system of claim 1, wherein: the predefined codeword is associated with the packaging system for the at least one article or the at least one article. ### Claim 5 (depends on 1) The packaging system of claim 1, wherein: the signal output by the first NFC/RFID integrated circuit is related to suspected counterfeiting or falsification or intrusion of the at least one article. ### Claim 6 (depends on 1) The packaging system of claim 1, wherein: the first NFC/RFID integrated circuit includes non-volatile memory that stores data representing the predefined codeword in an encrypted or scrambled form, and electronic circuitry that reads the data representing the predefined codeword in an encrypted or scrambled form from the non-volatile memory and processes such data to reconstruct the predefined codeword for comparison to the sensed codeword. ### Claim 7 (depends on 6) The packaging system of claim 6, wherein: the electronic circuitry comprises a controller. ### Claim 8 (depends on 1) The packaging system of claim 1, wherein: each one of the plurality of electrical circuits includes a resistor network that is electrically-coupled to a corresponding adjacent section pair. ### Claim 9 (depends on 8) The packaging system of claim 8, wherein: the first NFC/RFID integrated circuit includes a positive power supply voltage terminal and a ground power supply terminal; and the resistor network comprises a first resistor electrically coupled between the positive power supply voltage terminal and one section of the adjacent section pair, a second resistor electrically coupled between the positive power supply voltage terminal and the other section of the adjacent section pair, and a third resistor electrically coupled between the other section of the adjacent section pair and the ground power supply voltage terminal. ### Claim 10 (depends on 1) The packaging system of claim 1, wherein: the multilayer laminate structure encapsulates a transformative material which is configured to change impedance between first and second conductive layers of the multilayer laminate structure in response to an intrusion or perforation. ### Claim 11 (depends on 10) The packaging system of claim 10, wherein: the elongate sections of the multilayer laminate structure are electrically coupled to corresponding input terminals of the first NFC/RFID integrated circuit or a second NFC/RFID integrated circuit which is configured to detect the change in impedance between the first and second conductive layers of the multilayer laminate structure due to an intrusion or perforation and output a signal based thereon; or at least one detection surface that is separate from the elongate sections and defined by one of the first and second conductive layers of the multilayer laminate structure is electrically coupled to a corresponding input terminal of the first NFC/RFID integrated circuit or a second NFC/RFID integrated circuit which is configured to detect the change in impedance between the first and second conductive layers of the multilayer laminate structure due to an intrusion or perforation and output a signal based thereon. ### Claim 12 (depends on 11) The packaging system of claim 11, wherein: the signal output by the first NFC/RFID integrated circuit or the second NFC/RFID integrated circuit is related to suspected tampering or intrusion of the at least one article. ### Claim 13 (depends on 11) The packaging system of claim 11, wherein: the set of elongate sections of the multilayer laminate structure that are electrically coupled to the first NFC/RFID integrated circuit and a plurality of detection surfaces that are electrically coupled to the first NFC/RFID integrated circuit or the second NFC/RFID integrated circuit are arranged in an interdigitated layout. ### Claim 14 (depends on 11) The packaging system of claim 11, wherein: the set of elongate sections of the multilayer laminate structure that are electrically coupled to the first NFC/RFID integrated circuit and the at least one detection surface that is electrically coupled to the second NFC/RFID integrated circuit are arranged in a stacked configuration. ### Claim 15 (depends on 11) The packaging system of claim 11, wherein: the first NFC/RFID integrated circuit and the second NFC/RFID integrated circuit are arranged in a stacked configuration. ### Claim 16 (depends on 11) The packaging system of claim 11, wherein: the set of elongate sections of the multilayer laminate structure that are electrically coupled to the first NFC/RFID integrated circuit and the at least one detection surface that is electrically coupled to the second NFC/RFID integrated circuit are arranged in a stacked configuration; and the first NFC/RFID integrated circuit and the second NFC/RFID integrated circuit are arranged in a stacked configuration. ### Claim 17 (depends on 1) The packaging system of claim 1, further comprising: an additional multilayer laminate structure that encapsulates a transformative material between first and second conductive layers; and a second NFC/RFID integrated circuit electrically coupled to the antenna or additional antenna, wherein the second NFC/RFID integrated circuit is also electrically coupled to the first and second conductive layers of the additional multilayer laminate structure, wherein the transformative material is configured to change impedance between the first and second conductive layers in response to an intrusion or perforation, and wherein at least one operational characteristic of the second NFC/RFID integrated circuit is dependent on the change in impedance between the first and second conductive layers of the additional multilayer laminate structure due to an intrusion or perforation. ### Claim 18 (depends on 17) The packaging system of claim 17, wherein: the additional multilayer laminate structure includes at least one detection surface defined by one of the first and second conductive layers of the additional multilayer laminate structure; and the second NFC/RFID integrated circuit has at least one input terminal that is electrically coupled to the at least one detection surface, wherein the second NFC/RFID integrated circuit is configured to detect the change in impedance between the first and second conductive layers of the separate multilayer laminate structure due to an intrusion or perforation in the at least one detection surface and output a signal based thereon. ### Claim 19 (depends on 18) The packaging system of claim 18, wherein: the signal output by the second NFC/RFID integrated circuit is related to suspected tampering of the at least one article. ### Claim 20 (depends on 18) The packaging system of claim 18, wherein: the set of elongate sections of the multilayer laminate structure that are electrically coupled to the first NFC/RFID integrated circuit and the at least one detection surface that is electrically coupled to the second NFC/RFID integrated circuit are arranged in a stacked configuration. ### Claim 21 (depends on 18) The packaging system of claim 18, wherein: the first NFC/RFID integrated circuit and the second NFC/RFID integrated circuit are arranged in a stacked configuration. ### Claim 22 (depends on 18) The packaging system of claim 18, wherein: the set of elongate sections of the multilayer laminate structure that are electrically coupled to the first NFC/RFID integrated circuit and the at least one detection surface that is electrically coupled to the second NFC/RFID integrated circuit are arranged in a stacked configuration; and the first NFC/RFID integrated circuit and the second NFC/RFID integrated circuit are arranged in a stacked configuration. ### Claim 23 (depends on 1) The packaging system of claim 1, wherein: the first NFC/RFID integrated circuit further includes decode circuitry and a register, wherein the decode circuitry is configured to decode the voltage signals supplied by the plurality of electrical circuits to generate the sensed codeword, and wherein the register is configured to store the sensed codeword generated by the decode circuitry. ### Claim 24 (depends on 10) The packaging system of claim 10, wherein: the multilayer laminate structure has a first configuration that provides a relatively high impedance electrical current path between the first and second conductive layers under normal conditions absent intrusion or perforation; and the multilayer laminate structure has a second configuration that provides a relatively low impedance electrical current path between the first and second conductive layers in response to the intrusion or perforation. ### Claim 25 (depends on 10) The packaging system of claim 10, wherein: the transformative material undergoes a state change that changes impedance between the first and second conductive layers in response to the intrusion or perforation. ### Claim 26 (depends on 25) The packaging system of claim 25, wherein: the transformative material comprises a reactive material that undergoes a physical change or chemical reaction that irreversibly deposits material that forms to a relatively low impedance electrical current path between the first and second conductive layers in response to the intrusion or perforation. ### Claim 27 (depends on 26) The packaging system of claim 26, wherein: the multilayer laminate structure further includes an encapsulated reagent that reacts with the transformative material to aid the physical change or chemical reaction that irreversibly deposits material that form the relatively low impedance electrical current path between the first and second conductive layers in response to the intrusion or perforation. ### Claim 28 (depends on 26) The packaging system of claim 26, wherein: the multilayer laminate structure includes microcapsules of the transformative material or microcapsules of the reagent or both, where such microcapsules release encapsulated material or reagent for mixing in response to the intrusion or perforation. ### Claim 29 (depends on 10) The packaging system of claim 10, wherein: the transformative material comprises metal ions that undergo a galvanic displacement reaction that precipitates solid-phase metal in response to the intrusion, wherein the solid phase metal forms all or part of a low impedance electrical current path between the first and second conductive layers in response to the intrusion or perforation. ### Claim 30 (depends on 1) The packaging system of claim 1, wherein: the NFC/RFID integrated circuit is a passive NFC/RFID integrated circuit that cooperates with the antenna to receive and store electrical power from electromagnetic radiation emitted by an external NFC/RFID interrogator. ### Claim 31 (depends on 1) The packaging system of claim 1, which is configured as a sensing barrier or surface that protects at least one article, wherein: the first NFC/RFID integrated circuit is configured to detect and register suspected counterfeiting or falsification or intrusion of the at least one article. ### Claim 32 (depends on 1) The packaging system of claim 1, wherein: the at least one article is selected from the group consisting of medicine foods or beverages chemicals forensics samples electronics electro-mechanical products branded products lifestyle personal products documents or works of art plastics or rubbers fabrics or leather goods wood combinations of these products or other products thereof ### Claim 33 (depends on 1) A method of monitoring at least one packaged article, comprising: i) providing a packaging system of claim 1; and ii) employing an NFC/RFID interrogator to configure the first NFC/RFID integrated circuit of the packaging system to detect and register suspected counterfeiting or falsification of the at least one article. ### Claim 34 (depends on 33) A method according to claim 33, further comprising: iii) repeating the operations of ii) at multiple points in time to detect and register suspected counterfeiting or falsification of the at least one article over time. ### Claim 35 (depends on 34) A method according to claim 34, wherein: the multiple points in time are along the supply chain such that the first NFC/RFID integrated circuit of the packaging system detects and registers suspected counterfeiting or falsification of the at least one article along the supply chain. ### Claim 36 (depends on 33) A method according to claim 33, wherein: the multilayer laminate structure or another multilayer laminate structure of the packaging system encapsulates a transformative material between first and second conductive layers, wherein the transformative material is configured to change impedance between the first and second conductive layers in response to an intrusion or perforation in the multilayer laminate structure; the packaging system optionally includes a second NFC/RFID integrated circuit electrically coupled to the antenna or additional antenna, wherein the first NFC/RFID integrated circuit or the second NFC/RFID integrated circuit is electrically coupled to the first and second conductive layers; and an NFC/RFID interrogator is employed to configure the first NFC/RFID integrated circuit or the second NFC/RFID integrated circuit to detect and register an intrusion or perforation in the multilayer laminate structure that is related to suspected tampering of the at least one article. ### Claim 37 A packaging system for at least one article, comprising: a first multilayer laminate structure having a conductive layer that is configured to define a set of elongate sections; a first NFC/RFID integrated circuit electrically coupled to an antenna, wherein the first NFC/RFID integrated circuit has a plurality of input terminals electrically coupled to a plurality of electrical circuits that provide for electrical connection or electrical disconnection between sections in the set of elongate sections in accordance with a predefined codeword, wherein the first NFC/RFID integrated circuit is configured to sense voltage signals produced by the plurality of electrical circuits, determine a sensed codeword based on the sensed voltage signals, compare the sense codeword to the predefined codeword, and output a signal based on such comparison; a second multilayer laminate structure that encapsulates a transformative material between first and second conductive layers, wherein the transformative material is configured to change impedance between the first and second conductive layers in response to an intrusion or perforation in the second multilayer laminate structure; and a second NFC/RFID integrated circuit electrically coupled to the antenna or additional antenna, wherein the second NFC/RFID integrated circuit is electrically coupled to the first and second conductive layers of the second multilayer laminate structure, wherein the second NFC/RFID integrated circuit is configured to output a signal based on an intrusion or perforation in the second multilayer laminate structure. ### Claim 38 (depends on 37) The packaging system of claim 37, wherein: a signal output by the first NFC/RFID integrated circuit is related to suspected counterfeiting or falsification of the at least one article; and a signal output by the second NFC/RFID integrated circuit is related to suspected tampering or intrusion of the at least one article. ### Claim 39 (depends on 37) The packaging system of claim 37, wherein: first multilayer laminate structure and the first NFC/RFID integrated circuit are arranged in a stacked configuration above or below the second multilayer laminate structure and the second NFC/RFID integrated circuit. ### Claim 40 (depends on 37) The packaging system of claim 37, which is formed in a sheet or rolled form.