# US 2020/0401260 A1 · Touch panel and fabricating method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0401260 A1 - Document ID: US20200401260A1 - Status: Published application - Kind: A1 - Application number: 17/012,119 - Filed: 2020-09-04 - Published: 2020-12-24 - Earliest claimed: 2015-07-11 - Assignees: TPK Film Solutions (Xiamen) Inc. - Applicants: TPK Film Solutions (Xiamen) Inc. - Inventors: Liang-Yi Chang; Chien-Hung Kuan; Renqing Peng; Jiachun Li - Web page: https://patentgrep.com/patent/US20200401260A1 ## CPC - G06F 3/0412: {Digitisers structurally integrated in a display} - G06F 3/044: by capacitive means - G06F 3/0445: {using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer} - G06F 3/0446: {using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes} - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F 2203/04111: Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract A touch panel includes a cover plate, a first adhesive component, and a second adhesive component. The first adhesive component which is adhered underneath the cover plate, includes a plurality of first pattered sensing lines. The second adhesive component which is adhered underneath the first adhesive component, includes a plurality of second pattered sensing lines. The first pattered sensing lines and second pattered sensing lines are electrically insulated from each other. ## Claims ### Claim 1 A method of fabricating a touch panel, comprising: providing a cover plate; adhering a first adhesive component underneath the cover plate, comprising: removing a first release film from a first adhesive bearing layer to expose a first sticky surface of the first adhesive bearing layer; coating a first conducting layer on the first sticky surface of the first adhesive bearing layer; and patterning the first conducting layer to form a plurality of first patterned sensing lines, wherein the patterning the first conducting layer comprises etching the first conducting layer; and directly adhering a second adhesive component to the first adhesive component, comprising: coating a second conducting layer on a second adhesive bearing layer; and patterning the second conducting layer to form a plurality of second patterned sensing lines, wherein: the patterning the second conducting layer comprises etching the second conducting layer, and the plurality of first patterned sensing lines are electrically insulated from the plurality of second patterned sensing lines. ### Claim 2 (depends on 1) The method of claim 1, wherein the directly adhering the second adhesive component to the first adhesive component comprises: using the second adhesive bearing layer to adhere the plurality of second patterned sensing lines to the first adhesive component. ### Claim 3 (depends on 1) The method of claim 1, wherein: the adhering the first adhesive component underneath the cover plate comprises removing a second release film from the first adhesive bearing layer to expose a second sticky surface of the first adhesive bearing layer, the directly adhering the second adhesive component to the first adhesive component comprises removing a third release film from the second adhesive bearing layer to expose a first sticky surface of the second adhesive bearing layer, and the coating the second conducting layer comprises coating the second conducting layer on the first sticky surface of the second adhesive bearing layer. ### Claim 4 (depends on 3) The method of claim 3, wherein: the directly adhering the second adhesive component to the first adhesive component comprises directly adhering the first sticky surface of the second adhesive bearing layer to the second sticky surface of the first adhesive bearing layer, and the adhering the first adhesive component underneath the cover plate comprises directly adhering the first sticky surface of the first adhesive bearing layer to the cover plate. ### Claim 5 (depends on 1) The method of claim 1, wherein: the adhering the first adhesive component underneath the cover plate comprises removing a second release film from the first adhesive bearing layer to expose a second sticky surface of the first adhesive bearing layer, the directly adhering the second adhesive component to the first adhesive component comprises removing a third release film from the second adhesive bearing layer to expose a first sticky surface of the second adhesive bearing layer and removing a fourth release film from the second adhesive bearing layer to expose a second sticky surface of the second adhesive bearing layer, and the coating the second conducting layer comprises coating the second conducting layer on the second sticky surface of the second adhesive bearing layer. ### Claim 6 (depends on 5) The method of claim 5, wherein: the directly adhering the second adhesive component to the first adhesive component comprises directly adhering the first sticky surface of the second adhesive bearing layer to the first sticky surface of the first adhesive bearing layer. ### Claim 7 (depends on 5) The method of claim 5, wherein: the directly adhering the second adhesive component to the first adhesive component comprises directly adhering the first sticky surface of the second adhesive bearing layer to the second sticky surface of the first adhesive bearing layer, and the adhering the first adhesive component underneath the cover plate comprises directly adhering the first sticky surface of the first adhesive bearing layer to the cover plate. ### Claim 8 (depends on 1) The method of claim 1, wherein the etching the first conducting layer comprises performing at least one of laser etching, chemical etching, plasma etching, or photolithography. ### Claim 9 (depends on 1) The method of claim 1, wherein the etching the second conducting layer comprises performing at least one of laser etching, chemical etching, plasma etching, or photolithography. ### Claim 10 (depends on 1) The method of claim 1, wherein the adhering the first adhesive component underneath the cover plate comprises: removing a second release film from the first adhesive bearing layer to expose a second sticky surface of the first adhesive bearing layer, and adhering the second sticky surface of the first adhesive bearing layer to the cover plate after the patterning the first conducting layer. ### Claim 11 (depends on 1) The method of claim 1, wherein the adhering the first adhesive component underneath the cover plate comprises: adhering the first sticky surface of the first adhesive bearing layer to the cover plate after the patterning the first conducting layer. ### Claim 12 (depends on 1) The method of claim 1, wherein the first conducting layer comprises silver nanowires. ### Claim 13 (depends on 1) The method of claim 1, wherein: the directly adhering the second adhesive component to the first adhesive component comprises removing a second release film from the second adhesive bearing layer to expose a first sticky surface of the second adhesive bearing layer, and the coating the second conducting layer comprises coating the second conducting layer on the first sticky surface of the second adhesive bearing layer. ### Claim 14 (depends on 13) The method of claim 13, wherein the directly adhering the second adhesive component to the first adhesive component comprises: removing a third release film from the second adhesive bearing layer to expose a second sticky surface of the second adhesive bearing layer, and adhering the second sticky surface of the second adhesive bearing layer to the first adhesive component after the patterning the second conducting layer. ### Claim 15 (depends on 13) The method of claim 13, wherein the directly adhering the second adhesive component to the first adhesive component comprises: adhering the first sticky surface of the second adhesive bearing layer to the first adhesive component after the patterning the second conducting layer. ### Claim 16 A method of fabricating a touch panel, comprising: providing a cover plate; adhering a first adhesive component underneath the cover plate, comprising: coating a first conducting layer on a first adhesive bearing layer; and patterning the first conducting layer to form a plurality of first patterned sensing lines, wherein: the patterning the first conducting layer comprises etching the first conducting layer, and the plurality of first patterned sensing lines and the first adhesive bearing layer together define the first adhesive component; coating a second conducting layer on a second adhesive bearing layer; patterning the second conducting layer to form a plurality of second patterned sensing lines, wherein: the patterning the second conducting layer comprises etching the second conducting layer, and the plurality of second patterned sensing lines and the second adhesive bearing layer together define a second adhesive component; and directly adhering the second adhesive component to the first adhesive component after the patterning the second conducting layer. ### Claim 17 (depends on 16) The method of claim 16, comprising: removing a release film from the second adhesive bearing layer to expose a first sticky surface of the second adhesive bearing layer, wherein the directly adhering the second adhesive component to the first adhesive component comprises adhering the first sticky surface of the second adhesive bearing layer to the first adhesive component. ### Claim 18 (depends on 17) The method of claim 17, wherein the coating the second conducting layer comprises coating the second conducting layer on the first sticky surface. ### Claim 19 A method of fabricating a touch panel, comprising: providing a cover plate; adhering a first adhesive component underneath the cover plate, comprising: coating a first conducting layer on a first adhesive bearing layer; and patterning the first conducting layer to form a plurality of first patterned sensing lines, wherein the patterning the first conducting layer comprises etching the first conducting layer; and directly adhering a second adhesive component to the first adhesive component, comprising: removing a first release film from a second adhesive bearing layer to expose a first sticky surface of the second adhesive bearing layer; coating a second conducting layer on the first sticky surface of the second adhesive bearing layer; and patterning the second conducting layer to form a plurality of second patterned sensing lines, wherein: the patterning the second conducting layer comprises etching the second conducting layer, and the plurality of first patterned sensing lines are electrically insulated from the plurality of second patterned sensing lines. ### Claim 20 (depends on 19) The method of claim 19, wherein the directly adhering the second adhesive component to the first adhesive component comprises adhering the first sticky surface of the second adhesive bearing layer to the first adhesive component.