# US 2020/0401090 A1 · Systems and methods for tiering of heatpipes > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0401090 A1 - Document ID: US20200401090A1 - Status: Published application - Kind: A1 - Application number: 16/447,440 - Filed: 2019-06-20 - Published: 2020-12-24 - Earliest claimed: 2019-06-20 - Assignees: Dell Products L.P. - Applicants: Dell Products L.P. - Inventors: Travis C. NORTH; Christopher M. HELBERG; Austin M. SHELNUTT - Web page: https://patentgrep.com/patent/US20200401090A1 ## CPC - G06F 1/206: {comprising thermal management} - F28D 15/02: in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)} - F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)} - G06F 1/203: {for portable computers, e.g. for laptops} - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - H10W 40/73: for cooling by change of state - H05K 7/20663: {Liquid coolant with phase change, e.g. heat pipes} - H10W 40/226: {characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461)} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An information handling system may include an information handling resource, a heat-rejecting media thermally coupled to the information handling resource, the heat rejecting media comprising and a heatpipe structure comprising a plurality of heatpipes. The plurality of heatpipes may include a generally-cylindrical first pipe mechanically coupled at a location proximate the information handling resource and having a first cross-sectional area, a generally-cylindrical second pipe mechanically coupled to the first pipe having a second cross-sectional area less than the first cross-sectional area, and a generally-cylindrical third pipe mechanically coupled to the second pipe having a third cross-sectional area less than the second cross-sectional area, such that the second pipe is coupled between the first pipe and the third pipe and the first pipe, second pipe, and third pipe form a closed plenum, and a finstack structure comprising a plurality of fins mechanically and thermally coupled to the third pipe. ## Claims ### Claim 1 An information handling system comprising: an information handling resource; heat-rejecting media thermally coupled to the information handling resource, the heat rejecting media comprising: a heatpipe structure comprising a plurality of heatpipes, the plurality of heatpipes comprising: a generally-cylindrical first pipe mechanically coupled at a location proximate the information handling resource and having a first cross-sectional area based on a first height and a first lateral width; a generally-cylindrical second pipe mechanically coupled to the first pipe having a second cross-sectional area based on a second height and a second lateral width, wherein the second cross-sectional area is less than the first cross-sectional area and the second lateral width is less than the first lateral width; and a generally-cylindrical third pipe mechanically coupled to the second pipe having a third cross-sectional area based on a third height and a third lateral width, wherein the third cross-sectional area is less than the second cross-sectional area and the third lateral width is less than the second lateral width, such that the second pipe is coupled between the first pipe and the third pipe, and the first pipe, second pipe, and third pipe form a closed plenum; and a finstack structure comprising a plurality of fins mechanically and thermally coupled to the third pipe. ### Claim 2 (depends on 1) The information handling system of claim 1, wherein the heat-rejecting media further comprises a thermally-conductive baseplate mechanically coupled between the information handling resource and the first pipe. ### Claim 3 (depends on 1) The information handling system of claim 1, wherein at least one of the first pipe, second pipe, and third pipe is rectangular cylindrical in shape. ### Claim 4 (depends on 1) The information handling system of claim 1, wherein: the plurality of heatpipes further comprise: a generally-cylindrical fourth pipe mechanically coupled to the first pipe having a fourth cross-sectional area less than the first cross-sectional area; and a generally-cylindrical fifth pipe mechanically coupled to the fourth pipe having a fifth cross-sectional area less than the fourth cross-sectional area, such that the fourth pipe is coupled between the first pipe and the fifth pipe and such that the first pipe, second pipe, third pipe, fourth pipe, and fifth pipe form a closed plenum; and the heat-rejecting media further comprises a second finstack structure comprising a plurality of fins mechanically and thermally coupled to the fifth pipe. ### Claim 5 (depends on 4) The information handling system of claim 4, wherein the second cross-sectional area is equal to the fourth cross-sectional area. ### Claim 6 (depends on 4) The information handling system of claim 4, wherein the third cross-sectional area is equal to the fifth cross-sectional area. ### Claim 7 Heat-rejecting media comprising: a heatpipe structure comprising a plurality of heatpipes, the plurality of heatpipes comprising: a generally-cylindrical first pipe having a first cross-sectional area based on a first height and a first lateral width; a generally-cylindrical second pipe mechanically coupled to the first pipe having a second cross-sectional area based on a second height and a second lateral width, wherein the second cross-sectional area is less than the first cross-sectional area and the second lateral width is less than the first lateral width; and a generally-cylindrical third pipe mechanically coupled to the second pipe having a third cross-sectional area based on a third height and a third lateral width, wherein the third cross-sectional area is less than the second cross-sectional area and the third lateral width is less than the second lateral width, such that the second pipe is coupled between the first pipe and the third pipe, and the first pipe, second pipe, and third pipe form a closed plenum; and a finstack structure comprising a plurality of fins mechanically and thermally coupled to the third pipe. ### Claim 8 (depends on 7) The heat-rejecting media of claim 7, further comprising a thermally-conductive baseplate configured to be mechanically coupled between the information handling resource and the first pipe. ### Claim 9 (depends on 7) The heat-rejecting media of claim 7, wherein at least one of the first pipe, second pipe, and third pipe is rectangular cylindrical in shape. ### Claim 10 (depends on 7) The heat-rejecting media of claim 7, wherein: the plurality of heatpipes further comprise: a generally-cylindrical fourth pipe mechanically coupled to the first pipe having a fourth cross-sectional area less than the first cross-sectional area; and a generally-cylindrical fifth pipe mechanically coupled to the fourth pipe having a fifth cross-sectional area less than the fourth cross-sectional area, such that the fourth pipe is coupled between the first pipe and the fifth pipe and such that the first pipe, second pipe, third pipe, fourth pipe, and fifth pipe form a closed plenum; and the heat-rejecting media further comprises a second finstack structure comprising a plurality of fins mechanically and thermally coupled to the fifth pipe. ### Claim 11 (depends on 10) The heat-rejecting media of claim 10, wherein the second cross-sectional area is equal to the fourth cross-sectional area. ### Claim 12 (depends on 10) The heat-rejecting media of claim 10, wherein the third cross-sectional area is equal to the fifth cross-sectional area. ### Claim 13 A method for fabricating a heatpipe structure comprising: coupling a generally-cylindrical first pipe having a first cross-sectional area to a generally-cylindrical second pipe, the second pipe having a second cross-sectional area less than the first cross-sectional area; coupling a generally-cylindrical third pipe to the second pipe, the third pipe having a third cross-sectional area less than the second cross-sectional area, the coupling such that the second pipe is coupled between the first pipe and the third pipe, and the first pipe, second pipe, and third pipe form a closed plenum; and mechanically and thermally coupling a finstack structure comprising a plurality of fins to the third pipe. ### Claim 14 (depends on 13) The method of claim 13, further comprising mechanically coupling the first pipe to a thermally-conductive baseplate configured to be mechanically coupled between the information handling resource and the first pipe. ### Claim 15 (depends on 13) The method of claim 13, wherein at least one of the first pipe, second pipe, and third pipe is rectangular cylindrical in shape. ### Claim 16 (depends on 13) The method of claim 13, further comprising: mechanically coupling a generally-cylindrical fourth pipe to the first pipe having a fourth cross-sectional area less than the first cross-sectional area; mechanically coupling a generally-cylindrical fifth pipe to the fourth pipe having a fifth cross-sectional area less than the fourth cross-sectional area, such that the fourth pipe is coupled between the first pipe and the fifth pipe and such that the first pipe, second pipe, third pipe, fourth pipe, and fifth pipe form a closed plenum; and mechanically and thermally coupling a second finstack structure comprising a plurality of fins to the fifth pipe. ### Claim 17 (depends on 16) The method of claim 16, wherein the second cross-sectional area is equal to the fourth cross-sectional area. ### Claim 18 (depends on 16) The method of claim 16, wherein the third cross-sectional area is equal to the fifth cross-sectional area.