# US 2020/0399776 A1 · Advanced treated electrodeposited copper foil having long and island-shaped structures and copper clad laminate using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0399776 A1 - Document ID: US20200399776A1 - Status: Published application - Kind: A1 - Application number: 16/905,934 - Filed: 2020-06-19 - Published: 2020-12-24 - Earliest claimed: 2019-06-19 - Assignees: Co-Tech Development Corp. - Applicants: Co-Tech Development Corp. - Inventors: YUN-HSING SUNG; SHIH-SHEN LEE; HUNG-WEI HSU; CHUN-YU KAO - Web page: https://patentgrep.com/patent/US20200399776A1 ## CPC - C25D 5/16: Electroplating with layers of varying thickness - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - C25D 3/38: of copper - C25D 5/605: {Surface topography of the layers, e.g. rough, dendritic or nodular layers} - C25D 5/617: {Crystalline layers} - C25D 5/625: {Discontinuous layers, e.g. microcracked layers} - H05K 1/03: Use of materials for the substrate - H05K 3/384: {by plating} - H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} - H05K 2201/0355: Metal foils - Y10T 428/12431: Foil or filament smaller than 6 mils - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An advanced electrodeposited copper foil having long and island-shaped microstructures and a copper clad laminate using the same are provided. The advanced electrodeposited copper foil includes a micro-roughened surface. The micro-roughened surface has a plurality of copper crystals, a plurality of copper whiskers and a plurality of copper crystal groups which are in a non-uniform distribution and form into a long and island-shaped pattern. ## Claims ### Claim 1 An advanced electrodeposited copper foil having long and island-shaped microstructures, characterized by including a micro-roughened surface, wherein the micro-roughened surface has a plurality of copper crystals that are in a non-uniform distribution; wherein different quantities of the copper crystals are stacked together to form respective copper whiskers, and different quantities of the copper whiskers are grouped together to form respective copper crystal groups; wherein as observed by a scanning electron microscope operated with a +35 degrees tilt and under 10000× magnification, the micro-roughened surface has at least ten first smooth areas each having a length of 250 nm and a width of 250 nm, at least one second smooth area having a length of 500 nm and a width of 500 nm, and at least one long and island-shaped microstructure having a length of 1500 nm. ### Claim 2 (depends on 1) The advanced electrodeposited copper foil according to claim 1, wherein no copper crystals are present in each of the first and second smooth areas. ### Claim 3 (depends on 1) The advanced electrodeposited copper foil according to claim 1, wherein as observed by the scanning electron microscope operated with a +35 degrees tilt and under 10000× magnification, the at least one long and island-shaped microstructure has at least three of the copper crystals and/or copper whiskers. ### Claim 4 (depends on 1) The advanced electrodeposited copper foil according to claim 1, wherein each of the copper whiskers has a topmost copper crystal. ### Claim 5 (depends on 4) The advanced electrodeposited copper foil according to claim 4, wherein the topmost copper crystals are each in the shape of a conoid, a rod or a sphere. ### Claim 6 (depends on 1) The advanced electrodeposited copper foil according to claim 1, wherein the micro-roughened surface further has at least two stripe-shaped copper-free areas each having a length of 1000 nm. ### Claim 7 (depends on 1) The advanced electrodeposited copper foil according to claim 1, wherein the micro-roughened surface has a surface roughness (Rz JIS B 0601-1994) less than 2.1 μm. ### Claim 8 (depends on 1) The advanced electrodeposited copper foil according to claim 1, wherein the micro-roughened surface further includes a plurality of peaks and a plurality of grooves between the peaks, and the copper crystals, the copper whiskers and the copper crystal groups are correspondingly formed on the peaks. ### Claim 9 (depends on 8) The advanced electrodeposited copper foil according to claim 8, wherein each of the grooves has a U-shaped or V-shaped cross-sectional profile. ### Claim 10 A copper clad laminate, comprising: a substrate; and an advanced electrodeposited copper foil disposed on the substrate and having a micro-roughened surface that is bonded to a surface of the substrate, wherein the micro-roughened surface has a plurality of copper crystals that are in a non-uniform distribution; wherein different quantities of the copper crystals are stacked together to form respective copper whiskers, and different quantities of the copper whiskers are grouped together to form respective copper crystal groups; wherein as observed by a scanning electron microscope operated with a +35 degrees tilt and under 10000× magnification, the micro-roughened surface has at least ten first smooth areas each having a length of 250 nm and a width of 250 nm, at least one second smooth area having a length of 500 nm and a width of 500 nm, and at least one long and island-shaped microstructure having a length of 1500 nm. ### Claim 11 (depends on 10) The copper clad laminate according to claim 10, wherein no copper crystals are present in each of the first and second smooth areas. ### Claim 12 (depends on 10) The copper clad laminate according to claim 10, wherein as observed by the scanning electron microscope operated with a +35 degrees tilt and under 10000× magnification, the at least one long and island-shaped microstructure has at least three of the copper crystals and/or the copper whiskers. ### Claim 13 (depends on 10) The copper clad laminate according to claim 10, wherein each of the copper whiskers has a topmost copper crystal. ### Claim 14 (depends on 13) The copper clad laminate according to claim 13, wherein the topmost copper crystals are each in the shape of a conoid, a rod or a sphere. ### Claim 15 (depends on 10) The copper clad laminate according to claim 10, wherein the micro-roughened surface further has at least two stripe-shaped copper-free areas each having a length of 1000 nm. ### Claim 16 (depends on 10) The copper clad laminate according to claim 10, wherein the micro-roughened surface has a surface roughness (Rz JIS B 0601-1994) less than 2.1 μm. ### Claim 17 (depends on 10) The copper clad laminate according to claim 10, wherein the micro-roughened surface further includes a plurality of peaks and a plurality of grooves between the peaks, and the copper crystals, the copper whiskers and the copper crystal groups are correspondingly formed on the peaks. ### Claim 18 (depends on 17) The copper clad laminate according to claim 17, wherein each of the grooves has a U-shaped or V-shaped cross-sectional profile.