# US 2020/0399506 A1 · Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material

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- Number: US 2020/0399506 A1
- Document ID: US20200399506A1
- Status: Published application
- Kind: A1
- Application number: 16/767,908
- Filed: 2018-11-29
- Published: 2020-12-24
- Earliest claimed: 2017-12-01
- Assignees: Hitachi Chemical Company, Ltd.
- Applicants: Hitachi Chemical Company, Ltd.
- Inventors: Emi MIYAZAWA; Tsuyoshi HAYASAKA; Takashi KAWAMORI; Shinichiro SUKATA; Yoshihito INABA; Keisuke NISHIDO
- Web page: https://patentgrep.com/patent/US20200399506A1

## CPC

- C09J 4/06: {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 17/06: comprising glass as the main or only constituent of a layer, next to another layer of a specific {material}
- B32B 37/12: characterised by using adhesives
- B32B 43/006: {Delaminating}
- C08F 287/00: Macromolecular compounds obtained by polymerising monomers on to block polymers
- C09D 153/025: {modified}
- C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J 7/30: characterised by the adhesive composition
- C09J 9/02: Electrically-conducting adhesives
- C09J 11/04: inorganic
- C09J 201/00: Adhesives based on unspecified macromolecular compounds
- H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P 72/70: for supporting or gripping
- H10P 72/74: {using temporarily an auxiliary support}
- H10P 72/7448: {the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer}
- H10W 74/014: {using batch processing}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- B32B 2037/1253: {curable adhesive}
- B32B 2310/0825: using IR radiation
- C08K 3/08: Metals
- C08K 2003/085: {Copper}
- C08K 2201/001: Conductive additives
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2203/37: for repositionable or removable tapes
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- C09J 2301/408: additives as essential feature of the adhesive layer
- C09J 2301/502: process for debonding adherents
- C09J 2409/00: Presence of diene rubber
- C09J 2433/00: Presence of (meth)acrylic polymer
- H10P 72/7412: {the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08F: MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

## Claims

### Claim 1

A semiconductor device manufacturing method, the method comprising:
a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order; and
a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.

### Claim 2 (depends on 1)

The semiconductor device manufacturing method according to claim 1, wherein a light source for the incoherent light in the separation step is a xenon lamp.

### Claim 3 (depends on 1)

The semiconductor device manufacturing method according to claim 1, wherein the incoherent light in the separation step is light including at least infrared light.

### Claim 4 (depends on 1)

The semiconductor device manufacturing method according to claim 1, wherein the separation step is a step of irradiating the temporary fixation material layer with the incoherent light through the supporting member.

### Claim 5 (depends on 1)

The semiconductor device manufacturing method according to claim 1, wherein the temporary fixation material layer contains a cured product of a curable resin composition including electroconductive particles that generate heat upon absorbing light.

### Claim 6 (depends on 5)

The semiconductor device manufacturing method according to claim 5, wherein a content of the electroconductive particles is 30 to 90 parts by mass with respect to a total amount of 100 parts by mass of components other than the electroconductive particles in the curable resin composition.

### Claim 7 (depends on 5)

The semiconductor device manufacturing method according to claim 5, wherein the curable resin composition further includes a thermoplastic resin.

### Claim 8 (depends on 5)

The semiconductor device manufacturing method according to claim 5, wherein the curable resin composition further includes a polymerizable monomer and a polymerization initiator.

### Claim 9 (depends on 1)

The semiconductor device manufacturing method according to claim 1, wherein the temporary fixation material layer has a light absorbing layer that generates heat upon absorbing light.

### Claim 10 (depends on 9)

The semiconductor device manufacturing method according to claim 9, wherein the light absorbing layer is formed by sputtering or vacuum vapor deposition.

### Claim 11

A curable resin composition for a temporary fixation material for temporarily fixing a semiconductor member to a supporting member,
the curable resin composition for a temporary fixation material including electroconductive particles that generate heat upon absorbing light.

### Claim 12 (depends on 11)

The curable resin composition for a temporary fixation material according to claim 11, wherein a content of the electroconductive particles is 30 to 90 parts by mass with respect to a total amount of 100 parts by mass of components other than the electroconductive particles in the curable resin composition for a temporary fixation material.

### Claim 13 (depends on 11)

The curable resin composition for a temporary fixation material according to claim 11, further comprising a thermoplastic resin.

### Claim 14 (depends on 13)

The curable resin composition for a temporary fixation material according to claim 13, further comprising a polymerizable monomer and a polymerization initiator.

### Claim 15 (depends on 11)

A film for a temporary fixation material for temporarily fixing a semiconductor member to a supporting member,
the film for a temporary fixation material comprising the curable resin composition for a temporary fixation material according to claim 11.

### Claim 16

A laminated film for a temporary fixation material for temporarily fixing a semiconductor member to a supporting member,
the laminated film for a temporary fixation material comprising a light absorbing layer that generates heat upon absorbing light.

### Claim 17 (depends on 9)

The semiconductor device manufacturing method according to claim 9, wherein the temporary fixation material layer further has a resin cured product layer including a cured product of a curable resin component.

### Claim 18 (depends on 16)

The laminated film for a temporary fixation material according to claim 16, further comprising a resin layer including a curable resin component.