# US 2020/0399505 A1 · Polishing composition

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2020/0399505 A1
- Document ID: US20200399505A1
- Status: Published application
- Kind: A1
- Application number: 16/961,619
- Filed: 2018-12-21
- Published: 2020-12-24
- Earliest claimed: 2018-01-11
- Assignees: Fujimi Incorporated
- Applicants: Fujimi Incorporated
- Inventors: Yasuaki ITO; Naoto NOGUCHI
- Web page: https://patentgrep.com/patent/US20200399505A1

## CPC

- C09G 1/02: containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)}
- C09K 3/1463: {Aqueous liquid suspensions}
- B24B 37/00: Lapping machines or devices; Accessories (B24B3/00 takes precedence)
- H10P 52/402: {of semiconductor materials}
- H10P 90/129: {by polishing}
- H10D 62/8325: {Silicon carbide}
- H10D 62/8503: {Nitride Group III-V materials, e.g. AlN or GaN}
- C09G: POLISHING COMPOSITIONS (French polish C09F11/00); SKI WAXES
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES

## Abstract

The present invention provides a polishing composition with which polishing rates can be effectively improved and which is for polishing works to be polished. The polishing composition comprises water, abrasive grains, an oxidant, and a polishing accelerator. The polishing accelerator comprises at least one metal salt selected from the group consisting of alkali metal salts and alkaline-earth metal salts.

## Claims

### Claim 1

A polishing composition to be used in polishing an object to be polished, the polishing composition comprising:
water, an abrasive, an oxidant, and a polishing removal accelerator,
wherein the polishing composition contains at least one metal salt selected from the group consisting of an alkali metal salt and an alkaline earth metal salt as the polishing removal accelerator.

### Claim 2 (depends on 1)

The polishing composition according to claim 1,
wherein a concentration C1 [mol/L] of the metal salt and a concentration C2 [mol/L] of the oxidant in the polishing composition satisfy the following relationships:
0.0035≤C1; and
0.001≤C1/C2≤1.

### Claim 3 (depends on 1)

The polishing composition according to claim 1,
wherein the oxidant includes a composite metal oxide, and
the composite metal oxide includes a monovalent or divalent metal element other than transition metal elements, and a transition metal element in the fourth period in the periodic table.

### Claim 4 (depends on 1)

The polishing composition according to claim 1, wherein the abrasive is alumina particles.

### Claim 5 (depends on 1)

The polishing composition according to claim 1, wherein the oxidant is potassium permanganate.

### Claim 6 (depends on 1)

The polishing composition according to claim 1, wherein the oxidant is sodium periodate.

### Claim 7 (depends on 1)

The polishing composition according to claim 1, wherein a material constituting the object to be polished has a Vickers hardness of 1,500 Hv or more.

### Claim 8 (depends on 1)

The polishing composition according to claim 1, wherein a material constituting the object to be polished is silicon carbide.

### Claim 9 (depends on 1)

The polishing composition according to claim 1, wherein a material constituting the object to be polished is gallium nitride.

### Claim 10 (depends on 1)

A polishing method comprising: supplying the polishing composition according to claim 1 to an object to be polished and polishing the object to be polished.