# US 2020/0399494 A1 · Room temperature method for the production of inorganic electrotechnical thin layers and a thin layer heating system obtained in this manner > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0399494 A1 - Document ID: US20200399494A1 - Status: Published application - Kind: A1 - Application number: 17/009,890 - Filed: 2020-09-02 - Published: 2020-12-24 - Earliest claimed: 2015-02-26 - Assignees: Dynamic Solar Systems AG - Applicants: Dynamic Solar Systems AG - Inventors: Patrick LINDER; Daniel LINDER - Web page: https://patentgrep.com/patent/US20200399494A1 ## CPC - C09D 11/52: Electrically conductive inks - B41M 7/0045: {using protective coatings or film forming compositions cured by mechanical wave energy, e.g. ultrasonics, cured by electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams, or cured by magnetic or electric fields, e.g. electric discharge, plasma} - C09D 11/037: characterised by the pigment - H05B 3/34: flexible, e.g. heating nets or webs - H05B 2203/003: using serpentine layout - H05B 2203/013: Heaters using resistive films or coatings - H05B 2203/017: Manufacturing methods or apparatus for heaters - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - B41M: PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING, (correction of typographical errors B41J; processes for applying transfer pictures or the like B44C1/16; fluid media for correction of typographical errors by coating C09D10/00; printing textiles D06P) - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL ## Abstract Electrotechnical thin layers usable as heating resistance and/or substrate for conductor layers are produced at high cost and extremely slowly in the established methods. Industrial-scale methods that provide sufficient speed at room temperature are not available. This problem is solved by a room temperature printing process, wherein a redox-reactively deposited, graphite-containing base layer printed at room temperature is obtained, onto which a metal, by redox reaction during print, forms a metal layer in the micrometer scale within minutes to a few seconds in a corresponding manner. The double layer thus obtainable in one printing process is highly flexible, allows soldering to copper layers, and can be used particularly advantageously as a thin-layer heater. ## Claims ### Claim 1 A room temperature method of producing inorganic, electrotechnical thin layers, characterised in that by printing a1) electrically conductive inorganic agglomerates and/or a2) electrically semiconductive inorganic agglomerates b) in an industrial printing machine c) as a dispersion d) into predefined regions within an area e) of a flexible carrier and f1) via curing the printed dispersion to form at least a stabilizing marginal shell f2) at least one base layer is provided, wherein furthermore g1) the dispersion is an aqueous carbon suspension comprising at least one type of the carbon polymorphs of soot, graphite, activated carbon, tar, conductive black, furnace black, carbon black, lamp black, ESD black g2) the dispersion is adjusted to a reactive pH g3) the dispersion is a predominantly aqueous, freshly produced dispersion g4) the dispersion is a reacting mixture h) the dispersion is cured by accompanying reaction and i) the curing is conducted at room temperature and j) the curing is accelerated by contacting with at least one reagent, k) the obtained base layer being an oxidative or reductive layer, wherein reaction conditions are stored in solid solution. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein a PV layer sequence is formed as combination of several layers, including the base layer. ### Claim 3 (depends on 1) The method as claimed in claim 1, wherein the at least one further base layer applied is a layer comprising agglomerates of at least one chain-forming element, the chain-forming element being selected from the group consisting of boron, aluminum, gallium, indium, carbon, silicon, germanium, tin, lead, phosphorus, arsenic, antimony, sulfur, selenium, tellurium, bromine, iodine. ### Claim 4 (depends on 1) The method as claimed in claim 1, wherein the dispersion, prior to application, is obtained from a free-flowing mixture or solution which is admixed with at least one metal from the group consisting of Li, Na, K, Be, Mg, Ca, Sr, Ba, B, Al, Ga, In, TI, Si, Ge, Sn, Pb, As, Sb, Se, Te, Ti, Zr, Cr, Mn, Fe, Co, Ni, Cu, Zn, Hg, Au, Ag, Pt, Pd, Cd, with at least partial dissolution of the metal at an appropriate pH setting. ### Claim 5 (depends on 1) The method as claimed in claim 1, wherein the accompanying reaction is promoted by at least one measure, said at least one measure being selected from the group consisting of UV exposure, contacting with CO2, contacting with acidic gases, contacting with basic gases, contacting with oxidative gases, contacting with reducing gases, contacting with acid chlorides, contacting with urea solutions, contacting with metal oxide dispersion, contacting with metal carbonyls, contacting with metal complexes, contacting with metal compounds, contacting with metal salts. ### Claim 6 (depends on 1) The room temperature method comprising the base layer according to claim 1, wherein the dispersion is provided over a predefined area and cured to form the base layer, characterized in that the curing is conducted at room temperature, the curing is accelerated by contacting with at least one reagent, the at least one base layer including agglomerates of at least one chain-forming element, the chain-forming element consisting of carbon, wherein furthermore the dispersion is a predominantly aqueous carbon suspension comprising at least microscale graphite with an amorphous carbon component and up to 49% of additions of soot, activated carbon, tar, conductive black, furnace black, carbon black, lamp black, ESD black, the dispersion is admixed with at least one microscale metal powder of a base-soluble metal from the group consisting of silicon, aluminum and iron, the suspension is adjusted to a reactive pH greater than 7, applied as a reductive layer and is subjected to preliminary curing at least to form a stabilizing marginal shell, wherein the suspension applied in a thin layer is cured at least by accompanying UV exposure, providing the base layer with reductive, alkaline conditions stored in solid solution. ### Claim 7 (depends on 1) The method as claimed in claim 1, wherein, for production of an additional, conductive, electrotechnical thin layer, I1) a dispersion of a metal or a metal compound I2) is provided on the reductive or oxidative base layer, I3) the curing of the additional layer is conducted at room temperature, wherein I4) the curing is accelerated by contacting with the at least one metal compound to deposit a metal or a metal oxide. ### Claim 8 (depends on 7) The method as claimed in claim 7, wherein the base layer is provided in the form of a basic reductive layer comprising carbon, silicon, aluminum and iron. ### Claim 9 (depends on 7) The method as claimed in claim 7, wherein the dispersion used is an aqueous, fresh, slightly acidic copper sulfate solution. ### Claim 10 (depends on 7) The method as claimed in claim 7, wherein a metal layer of thickness 0.5 to 80 micrometers is deposited within 30 seconds. ### Claim 11 (depends on 7) The method as claimed in claim 7, wherein in a second step an additional cover layer is applied and cured in defined regions atop the base layer and then in a third step a metal layer is formed as electrode layer in the regions that are still exposed. ### Claim 12 (depends on 7) An electrotechnical double layer combination, usable as a thin-layer heater, obtained according to claim 7, having the cured basic reductive base layer atop an optional carrier, comprising carbon in the form of graphite and optionally up to 49% of further carbon polymorphs and/or carbon products, at least partly dissolved iron and/or aluminum of purity 96%, with 4% typical impurities such as silicon, boron, aluminum, phosphorus, magnesium, calcium, zinc, cured waterglass, metal silicates; and the metal layer reductively deposited thereon, composed of copper, in which case the metal layer has a metallic conductivity of 2.5±2.475 ohms per centimeter.