# US 2020/0399493 A1 · Composition, conductor, method for manufacturing same, and structure

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- Number: US 2020/0399493 A1
- Document ID: US20200399493A1
- Status: Published application
- Kind: A1
- Application number: 16/763,408
- Filed: 2018-11-13
- Published: 2020-12-24
- Earliest claimed: 2017-11-14
- Assignees: Hitachi Chemical Company, Ltd.
- Applicants: Hitachi Chemical Company, Ltd.
- Inventors: Kohsuke URASHIMA; Yoshinori EJIRI; Takaaki NOHDOH; Motoki YONEKURA; Ryuji AKEBI
- Web page: https://patentgrep.com/patent/US20200399493A1

## CPC

- C09D 11/52: Electrically conductive inks
- C09D 11/033: characterised by the solvent
- C09D 11/037: characterised by the pigment
- C09D 11/30: Inkjet printing inks
- H01B 1/02: mainly consisting of metals or alloys
- H01B 1/026: {Alloys based on copper}
- H01B 1/22: the conductive material comprising metals or alloys
- H01B 5/14: comprising conductive layers or films on insulating-supports
- H01B 13/00: Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B 13/0026: {Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal}
- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 3/10: in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- C09D 11/36: based on non-aqueous solvents
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Disclosed is a composition containing copper particles and organic solvents, in which the organic solvents include a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

## Claims

### Claim 1

A composition comprising:
copper particles; and
organic solvents,
wherein the organic solvents comprise a first organic solvent having a vapor pressure at 20° C. of 200 Pa or more and 20 kPa or less, and a second organic solvent having a vapor pressure at 20° C. of 0.5 Pa or more and less than 200 Pa.

### Claim 2 (depends on 1)

The composition according to claim 1, wherein a content of the copper particles is 20 to 80 parts by mass with respect to 100 parts by mass of the total mass of the composition.

### Claim 3 (depends on 1)

The composition according to claim 1, wherein a viscosity at 25° C. of the composition is 50 to 3000 mPa·s.

### Claim 4 (depends on 1)

The composition according to claim 1, wherein the composition is used for aerosol jet printing.

### Claim 5 (depends on 1)

A method for producing a conductor, comprising:
atomizing the composition according to claim 1; and
printing the atomized composition.

### Claim 6 (depends on 5)

The method for producing a conductor according to claim 5, further comprising sintering the printed composition.

### Claim 7 (depends on 1)

A conductor comprising a sintered body obtained by sintering the composition according to claim 1.

### Claim 8 (depends on 7)

A structure comprising:
a base material; and
the conductor according to claim 7 provided on the base material.