# US 2020/0394484 A1 · Electronic antenna module optimised for a chip card with a dual communication interface > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2020/0394484 A1 - Document ID: US20200394484A1 - Status: Published application - Kind: A1 - Application number: 16/767,028 - Filed: 2018-11-20 - Published: 2020-12-17 - Earliest claimed: 2017-11-24 - Assignees: Smart Packaging Solutions - Applicants: Smart Packaging Solutions - Inventors: Bernard CALVAS; Guillaume GERIN; Kevin FABRIZIO - Web page: https://patentgrep.com/patent/US20200394484A1 ## CPC - G06K 19/07: with integrated circuit chips - G06K 19/07769: {the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface} - G06K 19/07749: {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card} - G06K 19/07754: {the connection being galvanic} - H01Q 7/00: Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts. ## Claims ### Claim 1 Electronic module for a smart card, comprising a substrate having on a first face a terminal block of electrical contacts standardized according to ISO 7816 allowing operation by contact with the corresponding contacts of a smart card reader, and comprising on a second face an antenna and a microelectronic chip protected by an encapsulation zone and provided with a contact communication and a contactless communication interface, the electrical contacts being connected to the chip by conductive wires passing through connection wells, the antenna comprising a plurality of turns located on the periphery of the module and a proximal connection pad and a distal connection pad arranged inside the encapsulation zone and intended to be connected to corresponding terminals of said contactless communication interface of the chip, and the turns of the antenna comprising a localized recess bypassing the distal connection pad and oriented towards the chip, wherein the distal connection pad is located at a small distance d from the edge of the encapsulation zone, and wherein the internal edges of the connection wells of the two contacts closest to the distal connection pad are spread outwards from the module with respect to the internal edges of the connection wells of the other contacts, so as to maximize the space available between the distal connection pad and said connection wells for the passage of the antenna tracks. ### Claim 2 (depends on 1) Electronic module according to claim 1, wherein the distance d between the edge of the encapsulation zone and the outer edge of the distal connection pad is between 0 and 500 micrometers. ### Claim 3 (depends on 1) Electronic module according to claim 1, wherein the spacing distance between the internal edges of the connection wells of the two contacts closest to the distal connection pad has a value of about 6 millimeters. ### Claim 4 (depends on 1) Electronic module according to claim 1, wherein the spacing distance between the outer edges of the connection wells closest to the distal connection pad has a value of about 7 millimeters. ### Claim 5 (depends on 1) Electronic module according to claim 1, wherein the connection wells of the contacts located in the vicinity of the recess of the antenna are oblong to facilitate the passage of the connection wires between the chip and said contacts. ### Claim 6 (depends on 5) Electronic module according to claim 5, wherein the width of the connection wells located in the vicinity of the recess of the antenna is less than 600 micrometers. ### Claim 7 (depends on 1) Electronic module according to claim 1, wherein the most internal turn of the antenna surrounds the area of the microelectronic chip and comprises several proximal studs distributed along the internal coil and corresponding to different antenna lengths and different inductances, so that the antenna located between the distal pad and one of the proximal pads has an inductance L capable of being selected, when it is connected to the microelectronic chip and according to the capacity C thereof, to obtain a target resonance frequency. ### Claim 8 (depends on 7) Electronic module according to claim 7, wherein the internal turn of the antenna of the module comprises at least six proximal connection pads. ### Claim 9 (depends on 7) Electronic module according to claim 7, wherein the inductance L is between 1.3 and 1.45 micro Henry and that the capacitance C of the chip is between 45 and 104 pico Farad. ### Claim 10 (depends on 1) Smart card with a dual contact and contactless communication interfaces, comprising an electronic module according to claim 1.