US 2020/0370191 A1Published application

Method to enable electroplating of golden silver nanoparticles

AssigneeAG-Nano System LLC

InventorMargaret Parker

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Abstract

A method to enable electroplating of nano-silver like gold material ([Ag25(SR)18]− where SR is a thiolate). The method includes activating a surface of a substrate using first counter flow conditioning rinses (CFCR) with a solution of acetone followed by a solution of alcohol; rinsing the substrate surface; drying using a nitrogen gas; cleaning using a soak-clean solution; activating using an activator solution; rinsing using an ammonia dead rinse solution; conditioning using second CFCR; etching using hydrochloric acid; rinsing third CFCR; depositing woods nickel strike material and electrolytic nickel metal; electrodeposition of a gold strike metal to the surface of the substrate; and electroplating of a nano-silver like gold material and a nano-silver like gold alloy material on to the surface of the substrate using an electroplating solution and a rate of deposition 0.0001 μm/h.

Claims14

Dependent claims

A method of electroplating nanomaterial, comprising:

activating a surface of a substrate by a plurality of first counter flow conditioning rinses with a solution of acetone followed by a solution of alcohol;
rinsing the activated surface of the substrate;
drying the activated surface using a nitrogen gas;
cleaning the activated surface using a soak-clean solution comprising 15wt % non-etch type alkaline cleaner;
activating the surface activated surface using an activator solution comprising 20 wt % activator;
rinsing the activated surface of the substrate using an ammonia dead rinse solution comprising 5 wt % ammonium hydroxide and DI water;
conditioning the activated surface of substrate using a plurality of second counter flow conditioning rinses;
etching the activated surface of the substrate using a solution of 20 wt % hydrochloric acid;
rinsing the activated surface of the substrate using a plurality of third counter flow conditioning rinses;
depositing a nickel strike material and electrolytic nickel metal on to the activated surface of the substrate at the same time;
electroplating a gold strike metal to the activated surface of the substrate;
and
electroplating a nano-silver material which looks and behaves like gold on to the activated surface of the substrate using an electroplating solution and a rate of deposition 0.0001 μm/hr;
wherein
the nano-silver material comprises a molecular formula of [Ag25(thiolate)18]−;
and
the electroplating solution comprises a pH level of 3.5-6.5.

14 more elements

A method of electroplating nanomaterial, comprising:

activating a surface of a substrate by a plurality of first counter flow conditioning rinses using a solution of acetone and a solution of an alcohol,
rinsing the activated surface of the substrate;
drying the activated surface of the substrate using a nitrogen gas;
conditioning the activated surface of substrate using a desmear solution comprising 15 wt % conditioner;
rinsing the activated surface of the substrate using a deoxidation solution comprising 30 wt % deoxidant;
conditioning the activated surface of substrate using a plurality of second counter flow rinses;
rinsing the activated surface of the substrate using a second deoxidation solution comprising 10 wt % deoxidant;
rinsing the activated surface of the substrate using a plurality of third counter flow conditioning rinses;
depositing electrolytic copper and electrolytic nickel metal to the activated surface of the substrate;
electroplating a gold strike metal to the activated surface of the substrate of the substrate;
and
electroplating a nano-silver nanoparticle which looks and behaves like gold to the activated surface of the substrate
wherein
the substrate comprises a brass material or a leaded brass alloy;
the nano-silver nanoparticle comprises a molecular formula of [Ag25(thiolate)18]−;
the step of electroplating utilizes an electroplating solution;
the electroplating solution comprises a pH level of 3.5-6.5;
and
the step of electroplating comprises a rate of deposition of 0.0001 gm/h.

16 more elements

Dependencies are inferred from the claim text.