Polishing solution and polishing method
AssigneeHitachi Chemical Company, Ltd.
InventorsShunsuke KONDO, Keisuke INOUE, Mayumi OUCHI, Yuya OTSUKA
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Abstract
Provided is a method for polishing an article including a Co-containing portion to be polished by a polishing liquid, in which the polishing liquid contains water, abrasive particles, and a metal dissolving agent, a pH of the polishing liquid is 6.0 or more, and a content of hydrogen peroxide in the polishing liquid is 0.0001% by mass or less based on the total mass of the polishing liquid.
Claims9
A method for polishing an article including a Co-containing portion to be polished by a polishing liquid, wherein
- the polishing liquid contains water, abrasive particles, and a metal dissolving agent,
- a pH of the polishing liquid is 6.0 or more, and
- a content of hydrogen peroxide in the polishing liquid is 0.0001% by mass or less based on the total mass of the polishing liquid.
A polishing liquid used for polishing an article including a Co-containing portion to be polished, the polishing liquid comprising:
- water;
- abrasive particles;
- and a metal dissolving agent, wherein
- a pH of the polishing liquid is 6.0 or more, and
- a content of hydrogen peroxide is 0.0001% by mass or less based on the total mass of the polishing liquid.
Dependencies are inferred from the claim text.