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US 2020/0369031 A1Published application
Molded printhead
AssigneeHewlett-Packard Development Company, L.P.
InventorsSilam J. Choy, Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
Life of this patent
Estimating the term…
Abstract
In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.
Claims15
A printhead, comprising:
- a printhead die having a front face along which fluid is to be dispensed from the printhead die and a back part away from the front face;
- and
- an electrical connection between the back part of the printhead die and an electrical component, wherein the electrical connection is fully encapsulated in a molding.
A printhead, comprising:
- a printhead die comprising a front face along which fluid, when present, is to be dispensed, the printhead die molded into a monolithic molding having a channel therein through which fluid is to pass to a back part of the printhead die;
- and
- an electrical connection extending between the back part of the printhead die and an electrical component, wherein the electrical connection is fully encapsulated in the monolithic molding.
A printhead, comprising:
- an elongated cuboidal printhead die sliver in a monolithic molding covering a back part and sides of the die sliver leaving a front of the die sliver exposed along a planar surface that includes a front face of the die sliver and a front face of the molding surrounding the front face of the die sliver, the monolithic molding having an opening therein through which fluid, when present, is to pass to the back part of the die sliver;
- and
- an electrical connection extending between the back part of the printhead die and an electrical component, wherein the electrical connection is fully encapsulated in the monolithic molding.
Dependencies are inferred from the claim text.