Polishing apparatus and polishing method
OwnerYoshikazu KATO, Makoto FUKUSHIMAinventors
Life of this patent
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Abstract
A polishing apparatus capable of accurately detecting a change in wafer condition is disclosed. The polishing apparatus includes: a polishing table for supporting a polishing pad having a polishing surface; a rotatable head body having a pressing surface arranged to press a wafer against the polishing surface; a retainer ring surrounding the pressing surface, the retainer ring being rotatable together with the head body and arranged to press the polishing surface; a non-rotating member that does not rotate together with the retainer ring; a vibration transmission member in contact with both the retainer ring and the non-rotating member; and a sensor secured to the non-rotating member.
Claims17
A polishing apparatus comprising:
- a polishing table for supporting a polishing pad having a polishing surface;
- a rotatable head body having a pressing surface arranged to press a wafer against the polishing surface;
- a retainer ring surrounding the pressing surface, the retainer ring being rotatable together with the head body and arranged to press the polishing surface;
- a non-rotating member that does not rotate together with the retainer ring;
- a vibration transmission member in contact with both the retainer ring and the non-rotating member;
- and
- a sensor secured to the non-rotating member.
A polishing method comprising:
- rotating a polishing table supporting a polishing pad;
- pressing a wafer against a polishing surface of the polishing pad by a pressing surface of a head body, while rotating the head body;
- pressing a retainer ring against the polishing surface, while rotating the retainer ring together with the head body and the wafer, the retainer ring being arranged around the wafer;
- and
- measuring, by a sensor, a vibration transmitted from the retainer ring to a non-rotating member via a vibration transmission member, the sensor being secured to the non-rotating member.
Dependencies are inferred from the claim text.