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US 2020/0364600 A1Published application
Quantum computing assemblies
AssigneeIntel Corporation
InventorsAdel A. Elsherbini, Shawna M. Liff, Jeanette M. Roberts, James S. Clarke
Life of this patent
Estimating the term…
Abstract
Quantum computing assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a quantum computing assembly may include: a package substrate; a first die coupled to the package substrate; and a second die coupled to the second surface of the package substrate and coupled to the first die; wherein the first die or the second die includes quantum processing circuitry.
Claims23
A quantum computing assembly, comprising:
- a package substrate having a first surface and an opposing second surface;
- a first die having a first surface and an opposing second surface, wherein the first surface of the first die is coupled to the second surface of the package substrate by first interconnects, and the first surface of the first die is at least partially between the second surface of the package substrate and the second surface of the first die;
- and
- a second die having a first surface and an opposing second surface, wherein the first surface of the second die is coupled to the second surface of the package substrate by second interconnects, the first surface of the second die is coupled to the second surface of the first die by third interconnects, and the first surface of the second die is at least partially between the second surface of the package substrate and the second surface of the second die;
- wherein the first die or the second die includes quantum processing circuitry.
2 more elements
A quantum computing assembly, comprising:
- a first die having a first surface and an opposing second surface, first conductive contacts at the first surface of the first die, and second conductive contacts at the second surface of the first die;
- and
- a second die having a first surface and an opposing second surface, first conductive contacts at the first surface of the second die, and second conductive contacts at the first surface of the second die;
- wherein the second conductive contacts of the first die are coupled to the first conductive contacts of the second die by interconnects, the second conductive contacts of the second die are not coupled to conductive contacts at the second surface of the first die, the second surface of the first die is between the first surface of the first die and the first surface of the second die, a footprint of the first die is contained within a footprint of the second die, and the first die or the second die includes quantum processing circuitry.
1 more element
(canceled)
A quantum computing assembly, comprising:
- a plurality of first dies, individual ones of the first dies having a first surface and an opposing second surface, first conductive contacts at the first surfaces of individual ones of the first dies, and second conductive contacts at the second surfaces of individual ones of the first die;
- and
- a second die having a first surface and an opposing second surface, first conductive contacts at the first surface of the second die, and second conductive contacts at the first surface of the second die;
- wherein the second conductive contacts of the first dies are coupled to the first conductive contacts of the second die by interconnects, the second conductive contacts of the second die are not coupled to conductive contacts at the second surfaces of the first dies, the second surfaces of the first dies are between the first surfaces of the first dies and the first surface of the second die, and footprint of the first dies are contained within a footprint of the second die, and a first die or the second die includes quantum processing circuitry.
1 more element
19-21. (canceled)
(canceled)
Dependencies are inferred from the claim text.